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    Cosimulation of electromagnetics-circuit systems exploiting DGTD and MNA

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    Type
    Article
    Authors
    Li, Ping
    Jiang, Lijun
    Bagci, Hakan cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Computational Electromagnetics Laboratory
    Date
    2014-06
    Permanent link to this record
    http://hdl.handle.net/10754/563574
    
    Metadata
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    Abstract
    A hybrid electromagnetics (EM)-circuit simulator exploiting the discontinuous Galerkin time domain (DGTD) method and the modified nodal analysis (MNA) algorithm is developed for analyzing hybrid distributive and nonlinear multiport lumped circuit systems. The computational domain is split into two subsystems. One is the EM subsystem that is analyzed by DGTD, while the other is the circuit subsystem that is solved by the MNA method. The coupling between the EM and circuit subsystems is enforced at the lumped port where related field and circuit unknowns are coupled via the use of numerical flux, port voltages, and current sources. Since the spatial operations of DGTD are localized, thanks to the use of numerical flux, coupling matrices between EM and circuit subsystems are small and are directly inverted. To handle nonlinear devices within the circuit subsystem, the standard Newton-Raphson method is applied to the nonlinear coupling matrix system. In addition, a local time-stepping scheme is applied to improve the efficiency of the hybrid solver. Numerical examples including single and multiport linear/nonlinear circuit networks are presented to validate the proposed solver. © 2014 IEEE.
    Citation
    Li, P., Jiang, L. J., & Bagci, H. (2014). Cosimulation of Electromagnetics-Circuit Systems Exploiting DGTD and MNA. IEEE Transactions on Components, Packaging and Manufacturing Technology, 4(6), 1052–1061. doi:10.1109/tcpmt.2014.2316137
    Sponsors
    This work was supported in part by the Research Grants Council of Hong Kong under Grant GRF 713011 and Grant GRF 712612, in part by the National Science Foundation of China under Grant 61271158, and in part by the University Grants Council of Hong Kong under Contract AoE/P-04/08. Recommended for publication by Associate Editor E.-P. Li upon evaluation of reviewers' comments.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    IEEE Transactions on Components, Packaging and Manufacturing Technology
    DOI
    10.1109/TCPMT.2014.2316137
    ae974a485f413a2113503eed53cd6c53
    10.1109/TCPMT.2014.2316137
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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