A novel asymptotic expansion homogenization analysis for 3-D composite with relieved periodicity in the thickness direction
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ArticleDate
2014-06Permanent link to this record
http://hdl.handle.net/10754/563569
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A new asymptotic expansion homogenization analysis is proposed to analyze 3-D composite in which thermomechanical and finite thickness effects are considered. Finite thickness effect is captured by relieving periodic boundary condition at the top and bottom of unit-cell surfaces. The mathematical treatment yields that only 2-D periodicity (i.e. in in-plane directions) is taken into account. A unit-cell representing the whole thickness of 3-D composite is built to facilitate the present method. The equivalent in-plane thermomechanical properties of 3-D orthogonal interlock composites are calculated by present method, and the results are compared with those obtained by standard homogenization method (with 3-D periodicity). Young's modulus and Poisson's ratio obtained by present method are also compared with experiments whereby a good agreement is particularly found for the Young's modulus. Localization analysis is carried out to evaluate the stress responses within the unit-cell of 3-D composites for two cases: thermal and biaxial tensile loading. Standard finite element (FE) analysis is also performed to validate the stress responses obtained by localization analysis. It is found that present method results are in a good agreement with standard FE analysis. This fact emphasizes that relieving periodicity in the thickness direction is necessary to accurately simulate the real free-traction condition in 3-D composite. © 2014 Elsevier Ltd.Citation
Nasution, M. R. E., Watanabe, N., Kondo, A., & Yudhanto, A. (2014). A novel asymptotic expansion homogenization analysis for 3-D composite with relieved periodicity in the thickness direction. Composites Science and Technology, 97, 63–73. doi:10.1016/j.compscitech.2014.04.006Sponsors
Authors would like to extend their gratitude to the Tokyo Metropolitan Government for the financial support under the project of Asian Network of Major Cities 21 (ANMC-21).Publisher
Elsevier BVae974a485f413a2113503eed53cd6c53
10.1016/j.compscitech.2014.04.006