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    Flexible high-κ/Metal gate metal/insulator/metal capacitors on silicon (100) fabric

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    Type
    Article
    Authors
    Rojas, Jhonathan Prieto cc
    Ghoneim, Mohamed T. cc
    Young, Chadwin
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Electrical Engineering Program
    Integrated Nanotechnology Lab
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Date
    2013-10
    Permanent link to this record
    http://hdl.handle.net/10754/563021
    
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    Abstract
    Implementation of memory on bendable substrates is an important step toward a complete and fully developed notion of mechanically flexible computational systems. In this paper, we have demonstrated a simple fabrication flow to build metal-insulator-metal capacitors, key components of dynamic random access memory, on a mechanically flexible silicon (100) fabric. We rely on standard microfabrication processes to release a thin sheet of bendable silicon (area: 18 {\rm cm}2 and thickness: 25 \mu{\rm m}) in an inexpensive and reliable way. On such platform, we fabricated and characterized the devices showing mechanical robustness (minimum bending radius of 10 mm at an applied strain of 83.33% and nominal strain of 0.125%) and consistent electrical behavior regardless of the applied mechanical stress. Furthermore, and for the first time, we performed a reliability study suggesting no significant difference in performance and showing an improvement in lifetime projections. © 1963-2012 IEEE.
    Citation
    Rojas, J. P., Ghoneim, M. T., Young, C. D., & Hussain, M. M. (2013). Flexible High-$\kappa$/Metal Gate Metal/Insulator/Metal Capacitors on Silicon (100) Fabric. IEEE Transactions on Electron Devices, 60(10), 3305–3309. doi:10.1109/ted.2013.2278186
    Sponsors
    This work was supported in part by King Abdullah University of Science and Technology Office of Competitive Research Fund and in part by the Competitive Research under Grant CRG-1-2012-HUS-008. The review of this paper was arranged by Editor H. Shang.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    IEEE Transactions on Electron Devices
    DOI
    10.1109/TED.2013.2278186
    ae974a485f413a2113503eed53cd6c53
    10.1109/TED.2013.2278186
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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