3D lumped components and miniaturized bandpass filter in an ultra-thin M-LCP for SOP applications
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Permanent link to this recordhttp://hdl.handle.net/10754/562538
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AbstractIn this work, a library of 3D lumped components completely embedded in the thinnest, multilayer LCP (M-LCP) stack- up with four metallization layers and 100 μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional parallel plate capacitor. Based on the above mentioned library, a miniaturized bandpass filter is presented for the GPS application. It utilizes mutually coupled inductors and is the smallest reported in the literature with a size of (0.035×0.028×0.00089)λg. Finally, the same filter realized in a competing ceramic technology (LTCC) is compared in performance with the ultra-thin M-LCP design. The M-LCP module presented in this work is inherently exible and offers great potential for wearable and conformal applications.
CitationArabi, E., & Shamim, A. (2013). 3D LUMPED COMPONENTS AND MINIATURIZED BANDPASS FILTER IN AN ULTRA-THIN M-LCP FOR SOP APPLICATIONS. Progress In Electromagnetics Research C, 44, 197–210. doi:10.2528/pierc13090903