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    Thermal oxidation of Ni films for p-type thin-film transistors

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    Type
    Article
    Authors
    Jiang, Jie
    Wang, Xinghui
    Zhang, Qing cc
    Li, Jingqi
    Zhang, Xixiang cc
    KAUST Department
    Advanced Nanofabrication, Imaging and Characterization Core Lab
    Core Labs
    Imaging and Characterization Core Lab
    Material Science and Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2013
    Permanent link to this record
    http://hdl.handle.net/10754/562492
    
    Metadata
    Show full item record
    Abstract
    p-Type nanocrystal NiO-based thin-film transistors (TFTs) are fabricated by simply oxidizing thin Ni films at temperatures as low as 400 °C. The highest field-effect mobility in a linear region and the current on-off ratio are found to be 5.2 cm2 V-1 s-1 and 2.2 × 103, respectively. X-ray diffraction, transmission electron microscopy and electrical performances of the TFTs with "top contact" and "bottom contact" channels suggest that the upper parts of the Ni films are clearly oxidized. In contrast, the lower parts in contact with the gate dielectric are partially oxidized to form a quasi-discontinuous Ni layer, which does not fully shield the gate electric field, but still conduct the source and drain current. This simple method for producing p-type TFTs may be promising for the next-generation oxide-based electronic applications. © 2013 the Owner Societies.
    Citation
    Jiang, J., Wang, X., Zhang, Q., Li, J., & Zhang, X. X. (2013). Thermal oxidation of Ni films for p-type thin-film transistors. Physical Chemistry Chemical Physics, 15(18), 6875. doi:10.1039/c3cp50197c
    Publisher
    Royal Society of Chemistry (RSC)
    Journal
    Physical Chemistry Chemical Physics
    DOI
    10.1039/c3cp50197c
    ae974a485f413a2113503eed53cd6c53
    10.1039/c3cp50197c
    Scopus Count
    Collections
    Articles; Imaging and Characterization Core Lab; Physical Science and Engineering (PSE) Division; Material Science and Engineering Program

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