Passive low-cost inkjet-printed smart skin sensor for structural health monitoring
dc.contributor.author | Cook, Benjamin Stassen | |
dc.contributor.author | Shamim, Atif | |
dc.contributor.author | Tentzeris, Manos | |
dc.date.accessioned | 2015-08-03T10:37:29Z | |
dc.date.available | 2015-08-03T10:37:29Z | |
dc.date.issued | 2012-11-20 | |
dc.identifier.citation | Cook, B. S., Shamim, A., & Tentzeris, M. M. (2012). Passive low-cost inkjet-printed smart skin sensor for structural health monitoring. IET Microwaves, Antennas & Propagation, 6(14), 1536–1541. doi:10.1049/iet-map.2012.0188 | |
dc.identifier.issn | 17518725 | |
dc.identifier.doi | 10.1049/iet-map.2012.0188 | |
dc.identifier.uri | http://hdl.handle.net/10754/562418 | |
dc.description.abstract | Monitoring fatigue cracking of large engineering structures is a costly and time-intensive process. The authors' present the first low-cost inkjet-printed patch antenna sensor that can passively detect crack formation, orientation and shape by means of resonant frequency shifts in the two resonant modes of the antenna. For the first time, the effect of non-linear crack shapes on the parallel and perpendicular resonant modes of a patch antenna is quantified with simulation and measurement. This study presents a step towards fully integrated, low-cost, conformal and environmentally friendly smart skins for real-time monitoring of large structures. © The Institution of Engineering and Technology 2012. | |
dc.description.sponsorship | This work has been supported by NSF-ECS and IFC/SRC. | |
dc.publisher | Institution of Engineering and Technology (IET) | |
dc.title | Passive low-cost inkjet-printed smart skin sensor for structural health monitoring | |
dc.type | Article | |
dc.contributor.department | Electrical Engineering Program | |
dc.contributor.department | Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division | |
dc.contributor.department | Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab | |
dc.identifier.journal | IET Microwaves, Antennas & Propagation | |
dc.contributor.institution | Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, United States | |
kaust.person | Cook, Benjamin Stassen | |
kaust.person | Shamim, Atif |
This item appears in the following Collection(s)
-
Articles
-
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
For more information visit: https://impact.kaust.edu.sa/Pages/Home.aspx -
Electrical and Computer Engineering Program
For more information visit: https://cemse.kaust.edu.sa/ece -
Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
For more information visit: https://cemse.kaust.edu.sa/