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dc.contributor.authorLi, Huawei
dc.contributor.authorFan, Yiqiang
dc.contributor.authorConchouso Gonzalez, David
dc.contributor.authorFoulds, Ian G.
dc.date.accessioned2015-08-03T10:02:45Z
dc.date.available2015-08-03T10:02:45Z
dc.date.issued2012-10-19
dc.identifier.issn09601317
dc.identifier.doi10.1088/0960-1317/22/11/115037
dc.identifier.urihttp://hdl.handle.net/10754/562369
dc.description.abstractThis paper reports the process of creating bumps on the surface of polystyrene (PS) induced by a CO2laser at low powers. The paper also outlines the procedure for growing bumps induced by multiple laser scans on the aforementioned bumps. These bumps result from the net volume gain of the laser heat-affected zone on the PS rather than from a deposition process, and the expansion of the heat-affected zone on PS was verified by measuring the hardness change using nanoindentation. The bumps have a much smoother surface than microchannels fabricated with laser cutting; depending on the laser power, they have heights ranging from hundreds of nanometers to 42m. The laser scanning speed and scan times along with this technique offer a fast and low-cost alternative for fabricating molds for multi-depth PDMS microfluidic devices. © 2012 IOP Publishing Ltd.
dc.publisherIOP Publishing
dc.titleCO2laser-induced bump formation and growth on polystyrene for multi-depth soft lithography molds
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journalJournal of Micromechanics and Microengineering
kaust.personLi, Huawei
kaust.personFan, Yiqiang
kaust.personFoulds, Ian G.
kaust.personConchouso Gonzalez, David
dc.date.published-online2012-10-19
dc.date.published-print2012-11-01


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