Experimental and modeling study of the capacitance-voltage characteristics of metal-insulator-semiconductor capacitor based on pentacene/parylene
AuthorsWondmagegn, Wudyalew T.
Satyala, Nikhil T.
Mejia, Israel I.
Alshareef, Husam N.
Stiegler, Harvey J.
Quevedo-López, Manuel Angel Quevedo
Pieper, Ron J.
Gnade, Bruce E.
KAUST DepartmentFunctional Nanomaterials and Devices Research Group
Material Science and Engineering Program
Physical Science and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/561743
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AbstractThe capacitance-voltage (C-V) characteristics of metal-insulator- semiconductor (MIS) capacitors consisting of pentacene as an organic semiconductor and parylene as the dielectric have been investigated by experimental, analytical, and numerical analysis. The device simulation was performed using two-dimensional drift-diffusion methods taking into account the Poole-Frenkel field-dependent mobility. Pentacene bulk defect states and fixed charge density at the semiconductor/insulator interface were incorporated into the simulation. The analysis examined pentacene/parylene interface characteristics for various parylene thicknesses. For each thickness, the corresponding flat band voltage extracted from the C-V plot of the MIS structure was more negative than - 2.4 V. From the flat band voltage the existence of a significant mismatch between the work functions of the gate electrode and pentacene active material has been identified. Experimental and simulation results suggest the existence of interface charge density on the order of 3 × 1011 q/cm2 at the insulator/semiconductor interface. The frequency dispersion characteristics of the device are also presented and discussed. © 2011 Elsevier B.V.
CitationWondmagegn, W. T., Satyala, N. T., Mejia-Silva, I., Mao, D., Gowrisanker, S., Alshareef, H. N., … Gnade, B. E. (2011). Experimental and modeling study of the capacitance–voltage characteristics of metal–insulator–semiconductor capacitor based on pentacene/parylene. Thin Solid Films, 519(13), 4313–4318. doi:10.1016/j.tsf.2011.02.014
SponsorsWe gratefully acknowledge the Department of Defense for supporting this work (Army Research Office Contract W911NF-07-2-0059).
JournalThin Solid Films