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dc.contributor.authorElshurafa, Amro M.
dc.contributor.authorEl-Masry, Ezz I.
dc.date.accessioned2015-08-02T09:11:56Z
dc.date.available2015-08-02T09:11:56Z
dc.date.issued2010-03-22
dc.identifier.citationElshurafa, A. M., & El-Masry, E. I. (2010). MEMS variable capacitance devices utilizing the substrate: II. Zipping varactors. Journal of Micromechanics and Microengineering, 20(4), 045028. doi:10.1088/0960-1317/20/4/045028
dc.identifier.issn09601317
dc.identifier.doi10.1088/0960-1317/20/4/045028
dc.identifier.urihttp://hdl.handle.net/10754/561460
dc.description.abstractThis paper, the second and last in this series, introduces PolyMUMPS zipping varactors that exploit the substrate and provide a high tuning range and a high quality factor. Building on the important findings of part I of this paper, the substrate was utilized effectively once again in the design and fabrication of zipping varactors to attain devices with very good performance. Two zipping varactors are proposed, analysed theoretically, simulated, fabricated and tested successfully. The tuning range, quality factor and actuation voltage of those varactors are 4.5, 16.4, 55 V and 4.2, 17, 55 V respectively. Finally, and based on one of the proposed zipping varactors, a very large capacitance value varactor array, with a tuning range of 5.3, was designed and tested. To the best of our knowledge, these zipping varactors exhibit the best reported characteristics in PolyMUMPS to date within their category in terms of tuning range, quality factor, required actuation voltage and total area consumed. © 2010 IOP Publishing Ltd.
dc.description.sponsorshipThe authors would like to thank Dr T Hubbard for his valuable discussions and advice. This work was supported by grants from the Natural Sciences and Engineering Research Council of Canada (NSERC), by The Canadian Network of Centers of Excellence in Microelectronics (MICRONET), and by the Canadian Microelectronic Corporation (CMC Microsystems).
dc.publisherIOP Publishing
dc.titleMEMS variable capacitance devices utilizing the substrate: II. Zipping varactors
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentOCRF- Special Academic Partnership
dc.identifier.journalJournal of Micromechanics and Microengineering
dc.contributor.institutionElectrical and Computer Engineering, Dalhousie University, Halifax, NS, Canada
kaust.personElshurafa, Amro M.
dc.date.published-online2010-03-22
dc.date.published-print2010-04-01


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