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    MEMS variable capacitance devices utilizing the substrate: II. Zipping varactors

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    Type
    Article
    Authors
    Elshurafa, Amro M.
    El-Masry, Ezz I.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    OCRF- Special Academic Partnership
    Date
    2010-03-22
    Online Publication Date
    2010-03-22
    Print Publication Date
    2010-04-01
    Permanent link to this record
    http://hdl.handle.net/10754/561460
    
    Metadata
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    Abstract
    This paper, the second and last in this series, introduces PolyMUMPS zipping varactors that exploit the substrate and provide a high tuning range and a high quality factor. Building on the important findings of part I of this paper, the substrate was utilized effectively once again in the design and fabrication of zipping varactors to attain devices with very good performance. Two zipping varactors are proposed, analysed theoretically, simulated, fabricated and tested successfully. The tuning range, quality factor and actuation voltage of those varactors are 4.5, 16.4, 55 V and 4.2, 17, 55 V respectively. Finally, and based on one of the proposed zipping varactors, a very large capacitance value varactor array, with a tuning range of 5.3, was designed and tested. To the best of our knowledge, these zipping varactors exhibit the best reported characteristics in PolyMUMPS to date within their category in terms of tuning range, quality factor, required actuation voltage and total area consumed. © 2010 IOP Publishing Ltd.
    Citation
    Elshurafa, A. M., & El-Masry, E. I. (2010). MEMS variable capacitance devices utilizing the substrate: II. Zipping varactors. Journal of Micromechanics and Microengineering, 20(4), 045028. doi:10.1088/0960-1317/20/4/045028
    Sponsors
    The authors would like to thank Dr T Hubbard for his valuable discussions and advice. This work was supported by grants from the Natural Sciences and Engineering Research Council of Canada (NSERC), by The Canadian Network of Centers of Excellence in Microelectronics (MICRONET), and by the Canadian Microelectronic Corporation (CMC Microsystems).
    Publisher
    IOP Publishing
    Journal
    Journal of Micromechanics and Microengineering
    DOI
    10.1088/0960-1317/20/4/045028
    ae974a485f413a2113503eed53cd6c53
    10.1088/0960-1317/20/4/045028
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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