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    AuthorHussain, Muhammad Mustafa (1)Khan, S. M. (1)Nour, Maha A. (1)Qaiser, Nadeem (1)Rehman, M. U. (1)View MoreDepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division (1)Electrical Engineering Program (1)Integrated Disruptive Electronic Applications (IDEA) Lab (1)Integrated Nanotechnology Lab (1)JournalApplied Physics Letters (1)KAUST Grant Number
    OSR-2016-KKI-2880 (1)
    Publisher
    AIP Publishing (1)
    Subject3D printing (1)Deformation (1)
    Electronic circuits (1)
    Galactic properties (1)
    Numerical (1)
    View MoreTypeArticle (1)Year (Issue Date)
    2017 (1)
    Item Availability
    Open Access (1)

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    Mechanical response of spiral interconnect arrays for highly stretchable electronics

    Qaiser, Nadeem; Khan, S. M.; Nour, Maha A.; Rehman, M. U.; Rojas, J. P.; Hussain, Muhammad Mustafa (Applied Physics Letters, AIP Publishing, 2017-11-21) [Article]
    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.
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