Recent Submissions

  • CMOS Enabled Microfluidic Systems for Healthcare Based Applications

    Khan, Sherjeel M.; Gumus, Abdurrahman; Nassar, Joanna M.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2018-02-27)
    With the increased global population, it is more important than ever to expand accessibility to affordable personalized healthcare. In this context, a seamless integration of microfluidic technology for bioanalysis and drug delivery and complementary metal oxide semiconductor (CMOS) technology enabled data-management circuitry is critical. Therefore, here, the fundamentals, integration aspects, and applications of CMOS-enabled microfluidic systems for affordable personalized healthcare systems are presented. Critical components, like sensors, actuators, and their fabrication and packaging, are discussed and reviewed in detail. With the emergence of the Internet-of-Things and the upcoming Internet-of-Everything for a people-process-data-device connected world, now is the time to take CMOS-enabled microfluidics technology to as many people as possible. There is enormous potential for microfluidic technologies in affordable healthcare for everyone, and CMOS technology will play a major role in making that happen.
  • Corrugation Architecture Enabled Ultraflexible Wafer-Scale High-Efficiency Monocrystalline Silicon Solar Cell

    Bahabry, Rabab R.; Kutbee, Arwa T.; Khan, Sherjeel M.; Sepulveda, Adrian C.; Wicaksono, Irmandy; Nour, Maha A.; Wehbe, Nimer; Almislem, Amani Saleh Saad; Ghoneim, Mohamed T.; Sevilla, Galo T.; Syed, Ahad; Shaikh, Sohail F.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2018-01-02)
    Advanced classes of modern application require new generation of versatile solar cells showcasing extreme mechanical resilience, large-scale, low cost, and excellent power conversion efficiency. Conventional crystalline silicon-based solar cells offer one of the most highly efficient power sources, but a key challenge remains to attain mechanical resilience while preserving electrical performance. A complementary metal oxide semiconductor-based integration strategy where corrugation architecture enables ultraflexible and low-cost solar cell modules from bulk monocrystalline large-scale (127 × 127 cm) silicon solar wafers with a 17% power conversion efficiency. This periodic corrugated array benefits from an interchangeable solar cell segmentation scheme which preserves the active silicon thickness of 240 μm and achieves flexibility via interdigitated back contacts. These cells can reversibly withstand high mechanical stress and can be deformed to zigzag and bifacial modules. These corrugation silicon-based solar cells offer ultraflexibility with high stability over 1000 bending cycles including convex and concave bending to broaden the application spectrum. Finally, the smallest bending radius of curvature lower than 140 μm of the back contacts is shown that carries the solar cells segments.
  • Democratized electronics to enable smart living for all

    Hussain, Muhammad Mustafa; Nassar, Joanna M.; Khan, S. M.; Saikh, S. F.; Sevilla, Galo T.; Kutbee, Arwa T.; Bahabry, Rabab R.; Babatain, Wedyan; Muslem, A. S.; Nour, Maha A.; Wicaksono, I.; Mishra, Kush (IEEE, 2017-12-25)
    With the increased global population, smart living is an increasingly important criteria to ensure equal opportunities for all. Therefore, what is Smart Living? The first time when we tossed this terminology seven years back, we thought reducing complexities in human life. Today we believe it more. However, smart living for all complicates the technological need further. As by all, we mean any age group, any academic background and any financial condition. Although electronics are powerful today and have enabled our digital world, many as of today have not experienced that progress. Going forward while we realize more and more electronics in our daily life, the most important question would be how. Here we show, a heterogeneous integration approach to integrate low-cost high performance interactive electronic system which are physically compliant. We are redesigning electronics to redefine its purposes to reconfigure life for all to enable smart living.
  • Strain-Induced Rolled Thin Films for Lightweight Tubular Thermoelectric Generators

    Singh, Devendra; Kutbee, Arwa T.; Ghoneim, Mohamed T.; Hussain, Aftab M.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-11-24)
    Thermoelectric generators (TEGs) are interesting energy harvesters of otherwise wasted heat. Here, a polymer-assisted generic process and its mechanics to obtain sputtered thermoelectric (TE) telluride material-based 3D tubular structures with unprecedented length (up to seamless 4 cm and further expandable) are shown. This length allows for large temperature differences between the hot and the cold ends, a critical but untapped enabler for high power generation. Compared with a flat slab, better area efficiency is observed for a rolled tube and compared with a solid rod architecture, a rolled tube uses less material (thus making it lightweight and cost effective) and has competitive performance advantage due to a smaller contact area. It is also shown that a tubular architecture thermopile-based TEG is able to generate up to 5 μW of power (eight pairs of p- and n-type thermopiles) through a temperature difference of 60 °C. The demonstrated process can play an important role in transforming 2D atomic crystal structure TE materials into 3D tubular thermopiles for effective TEG application, which can maintain higher temperature differences by longer distances between hot and cold ends.
  • Mechanical response of spiral interconnect arrays for highly stretchable electronics

    Qaiser, Nadeem; Khan, S. M.; Nour, Maha A.; Rehman, M. U.; Rojas, J. P.; Hussain, Muhammad Mustafa (AIP Publishing, 2017-11-21)
    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.
  • Wavy Architecture Thin-Film Transistor for Ultrahigh Resolution Flexible Displays

    Hanna, Amir Nabil; Kutbee, Arwa Talal; Subedi, Ram Chandra; Ooi, Boon S.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-11-13)
    A novel wavy-shaped thin-film-transistor (TFT) architecture, capable of achieving 70% higher drive current per unit chip area when compared with planar conventional TFT architectures, is reported for flexible display application. The transistor, due to its atypical architecture, does not alter the turn-on voltage or the OFF current values, leading to higher performance without compromising static power consumption. The concept behind this architecture is expanding the transistor's width vertically through grooved trenches in a structural layer deposited on a flexible substrate. Operation of zinc oxide (ZnO)-based TFTs is shown down to a bending radius of 5 mm with no degradation in the electrical performance or cracks in the gate stack. Finally, flexible low-power LEDs driven by the respective currents of the novel wavy, and conventional coplanar architectures are demonstrated, where the novel architecture is able to drive the LED at 2 × the output power, 3 versus 1.5 mW, which demonstrates the potential use for ultrahigh resolution displays in an area efficient manner.
  • Modular Lego-Electronics

    Shaikh, Sohail F.; Ghoneim, Mohamed T.; Bahabry, Rabab R.; Khan, Sherjeel M.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-10-24)
    Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80% will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor-based ICs into modular Lego-electronics is shown with unique geometry that is physically identifiable to ease manufacturing and enhance throughput. Various geometries at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (up to 50 µm extra) allow targeted site binding like DNA assembly. Different geometries, angles, and heights for different modules provide a unique identity to each of the ICs. A two-level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The assembled ICs offer uncompromised electrical performance, higher yield, and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.
  • Nano-islands Based Charge Trapping Memory: A Scalability Study

    Elatab, Nazek; Saadat, Irfan; Saraswat, Krishna; Nayfeh, Ammar (Institute of Electrical and Electronics Engineers (IEEE), 2017-10-19)
    Zinc-oxide (ZnO) and zirconia (ZrO2) metal oxides have been studied extensively in the past few decades with several potential applications including memory devices. In this work, a scalability study, based on the ITRS roadmap, is conducted on memory devices with ZnO and ZrO2 nano-islands charge trapping layer. Both nano-islands are deposited using atomic layer deposition (ALD), however, the different sizes, distribution and properties of the materials result in different memory performance. The results show that at the 32-nm node charge trapping memory with 127 ZrO2 nano-islands can provide a 9.4 V memory window. However, with ZnO only 31 nano-islands can provide a window of 2.5 V. The results indicate that ZrO2 nano-islands are more promising than ZnO in scaled down devices due to their higher density, higher-k, and absence of quantum confinement effects.
  • Flexible and biocompatible high-performance solid-state micro-battery for implantable orthodontic system

    Kutbee, Arwa T.; Bahabry, Rabab R.; Alamoudi, Kholod O.; Ghoneim, Mohamed T.; Cordero, Marlon D.; Almuslem, Amani S.; Gumus, Abdurrahman; Diallo, Elhadj M.; Nassar, Joanna M.; Hussain, Aftab M.; Khashab, Niveen M.; Hussain, Muhammad Mustafa (Springer Nature, 2017-09-25)
    To augment the quality of our life, fully compliant personalized advanced health-care electronic system is pivotal. One of the major requirements to implement such systems is a physically flexible high-performance biocompatible energy storage (battery). However, the status-quo options do not match all of these attributes simultaneously and we also lack in an effective integration strategy to integrate them in complex architecture such as orthodontic domain in human body. Here we show, a physically complaint lithium-ion micro-battery (236 μg) with an unprecedented volumetric energy (the ratio of energy to device geometrical size) of 200 mWh/cm3 after 120 cycles of continuous operation. Our results of 90% viability test confirmed the battery’s biocompatibility. We also show seamless integration of the developed battery in an optoelectronic system embedded in a three-dimensional printed smart dental brace. We foresee the resultant orthodontic system as a personalized advanced health-care application, which could serve in faster bone regeneration and enhanced enamel health-care protection and subsequently reducing the overall health-care cost.
  • Stable MoS2 Field-Effect Transistors Using TiO2 Interfacial Layer at Metal/MoS2 Contact

    Park, Woojin; Min, Jung-Wook; Shaikh, Sohail F.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-09-07)
    Molybdenum disulphide (MoS2) is an emerging 2-dimensional (2D) semiconductor for electronic devices. However, unstable and low performance of MoS2 FETs is an important concern. In this study, inserting an atomic layer deposition (ALD) titanium dioxide (TiO2) interfacial layer between contact metal and MoS2 channel is suggested to achieve more stable performances. The reduced threshold voltage (VTH) shift and reduced series resistance (RSD) were simultaneously achieved.
  • Neuron-inspired flexible memristive device on silicon (100)

    Ghoneim, Mohamed T.; Hussain, Muhammad Mustafa (arXiv, 2017-06-18)
    Comprehensive understanding of the world's most energy efficient powerful computer, the human brain, is an elusive scientific issue. Still, already gained knowledge indicates memristors can be used as a building block to model the brain. At the same time, brain cortex is folded allowing trillions of neurons to be integrated in a compact volume. Therefore, we report flexible aluminium oxide based memristive devices fabricated and then derived from widely used bulk mono-crystalline silicon (100). We use complementary metal oxide semiconductor based processes to layout the foundation for ultra large scale integration (ULSI) of such memory devices to advance the task of comprehending a physical model of human brain.
  • Stretchable and foldable silicon-based electronics

    Cavazos Sepulveda, Adrian Cesar; Diaz Cordero, M. S.; Carreno, Armando Arpys Arevalo; Nassar, Joanna M.; Hussain, Muhammad Mustafa (AIP Publishing, 2017-03-30)
    Flexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
  • Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics

    Gumus, Abdurrahman; Alam, Arsalan; Hussain, Aftab M.; Mishra, Kush; Wicaksono, Irmandy; Sevilla, Galo T.; Shaikh, Sohail F.; Diaz, Marlon; Velling, Seneca; Ghoneim, Mohamed T.; Ahmed, Sally; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-03-29)
    In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high-performance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.
  • Freeform electronics for advanced healthcare

    Hussain, Muhammad Mustafa; Hussain, Aftab M.; Nassar, Joanna M.; Kutbee, Arwa T.; Gumus, Abdurrahman; Hanna, Amir (Institute of Electrical and Electronics Engineers (IEEE), 2017-02-16)
    Freeform (physically flexible, stretchable and reconfigurable) electronics can be critical enabler for advanced personalized healthcare. With increased global population and extended average lifetime of mankind, it is more important than ever to integrate advanced electronics into our daily life for advanced personalized healthcare. In this paper, we discuss some critical criteria to design such electronics with enabling applications.
  • Recyclable Nonfunctionalized Paper-Based Ultralow-Cost Wearable Health Monitoring System

    Nassar, Joanna M.; Mishra, Kush; Lau, Kirklann; Aguirre-Pablo, Andres A.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-02-15)
    A wearable health monitor using low-cost and recyclable paper continuously supervises and assesses body vital conditions simultaneously and in real time, such as blood pressure, heart rate, body temperature, and skin hydration. The affordability and high performance of the integrated “Paper Watch” provide an unprecedented flexible and portable approach for advanced personalized healthcare on the go.
  • Water soluble nano-scale transient material germanium oxide for zero toxic waste based environmentally benign nano-manufacturing

    Almuslem, A. S.; Hanna, Amir; Yapici, Tahir; Wehbe, N.; Diallo, Elhadj; Kutbee, Arwa T.; Bahabry, Rabab R.; Hussain, Muhammad Mustafa (AIP Publishing, 2017-02-14)
    In the recent past, with the advent of transient electronics for mostly implantable and secured electronic applications, the whole field effect transistor structure has been dissolved in a variety of chemicals. Here, we show simple water soluble nano-scale (sub-10 nm) germanium oxide (GeO) as the dissolvable component to remove the functional structures of metal oxide semiconductor devices and then reuse the expensive germanium substrate again for functional device fabrication. This way, in addition to transiency, we also show an environmentally friendly manufacturing process for a complementary metal oxide semiconductor (CMOS) technology. Every year, trillions of complementary metal oxide semiconductor (CMOS) electronics are manufactured and billions are disposed, which extend the harmful impact to our environment. Therefore, this is a key study to show a pragmatic approach for water soluble high performance electronics for environmentally friendly manufacturing and bioresorbable electronic applications.
  • A CMOS-compatible large-scale monolithic integration of heterogeneous multi-sensors on flexible silicon for IoT applications

    Nassar, Joanna M.; Sevilla, Galo T.; Velling, Seneca J.; Cordero, Marlon D.; Hussain, Muhammad Mustafa (Institute of Electrical and Electronics Engineers (IEEE), 2017-02-07)
    We report CMOS technology enabled fabrication and system level integration of flexible bulk silicon (100) based multi-sensors platform which can simultaneously sense pressure, temperature, strain and humidity under various physical deformations. We also show an advanced wearable version for body vital monitoring which can enable advanced healthcare for IoT applications.
  • Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics

    Ghoneim, Mohamed T.; Hussain, Muhammad Mustafa (Wiley-Blackwell, 2017-02-01)
    A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.
  • Impact of Physical Deformation on Electrical Performance of Paper-Based Sensors

    Nassar, Joanna M.; Hussain, Muhammad Mustafa (Institute of Electrical and Electronics Engineers (IEEE), 2017-01-23)
    We report on investigation of the mechanical properties of paper electronics (printed and made out of paper). One key objective of such paper electronics is to achieve ultraflexibility. Therefore, it is important to understand electrical functionality and reliability of paper electronics under various physical (mechanical) deformations. Here, we show the general mechanical properties of the cellulose paper used and its electrical behavior under applied strain, tackling the main effects that need to be identified when building paper-based systems, from product performance and stability perspective. An overview of the stress-strain behavior of silver ink on paper is discussed, and then, we tackle a more specific analysis of the performance variations of paper sensors made with recyclable household materials when exposed to various mechanical conditions of tensile and compressive bending. This paper is important for developing stable wearable sensors for incorporation into Internet of Everything applications.
  • Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications

    Shaikh, Sohail F.; Ghoneim, Mohamed T.; Sevilla, Galo T.; Nassar, Joanna M.; Hussain, Aftab M.; Hussain, Muhammad Mustafa (Institute of Electrical and Electronics Engineers (IEEE), 2017-01-17)
    The state-of-the-art electronics technology has been an integral part of modern advances. The prevalent rise of the mobile device and computational technology in the age of information technology offers exciting applications that are attributed to sophisticated, enormously reliable, and most mature CMOS-based electronics. We are accustomed to high performance, cost-effective, multifunctional, and energy-efficient scaled electronics. However, they are rigid, bulky, and brittle. The convolution of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible and stretchable device themes are being remarkably chased, the realization of the fully compliant electronic system is unaddressed. Integration of data processing, storage, communication, and energy management devices complements a compliant system. Here, a comprehensive review is presented on necessity and design criteria for freeform (physically flexible and stretchable) compliant high-performance CMOS electronic systems.

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