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    Low-cost silicon wafer dicing using a craft cutter

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    art3A10.10072Fs00542-014-2198-4.pdf
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    Description:
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    Type
    Article
    Authors
    Fan, Yiqiang
    Carreno, Armando Arpys Arevalo cc
    Li, Huawei
    Foulds, Ian G.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
    Date
    2014-05-20
    Online Publication Date
    2014-05-20
    Print Publication Date
    2015-07
    Permanent link to this record
    http://hdl.handle.net/10754/556898
    
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    Abstract
    This paper reports a low-cost silicon wafer dicing technique using a commercial craft cutter. The 4-inch silicon wafers were scribed using a crafter cutter with a mounted diamond blade. The pre-programmed automated process can reach a minimum die feature of 3 mm by 3 mm. We performed this scribing process on the top polished surface of a silicon wafer; we also created a scribing method for the back-unpolished surface in order to protect the structures on the wafer during scribing. Compared with other wafer dicing methods, our proposed dicing technique is extremely low cost (lower than $\$$1,000), and suitable for silicon wafer dicing in microelectromechanical or microfluidic fields, which usually have a relatively large die dimension. The proposed dicing technique is also usable for dicing multiple project wafers, a process where dies of different dimensions are diced on the same wafer.
    Citation
    Low-cost silicon wafer dicing using a craft cutter 2014, 21 (7):1411 Microsystem Technologies
    Publisher
    Springer Nature
    Journal
    Microsystem Technologies
    DOI
    10.1007/s00542-014-2198-4
    Additional Links
    http://link.springer.com/10.1007/s00542-014-2198-4
    ae974a485f413a2113503eed53cd6c53
    10.1007/s00542-014-2198-4
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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