KAUST DepartmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
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AbstractThis paper reports a low-cost silicon wafer dicing technique using a commercial craft cutter. The 4-inch silicon wafers were scribed using a crafter cutter with a mounted diamond blade. The pre-programmed automated process can reach a minimum die feature of 3 mm by 3 mm. We performed this scribing process on the top polished surface of a silicon wafer; we also created a scribing method for the back-unpolished surface in order to protect the structures on the wafer during scribing. Compared with other wafer dicing methods, our proposed dicing technique is extremely low cost (lower than $1,000), and suitable for silicon wafer dicing in microelectromechanical or microfluidic fields, which usually have a relatively large die dimension. The proposed dicing technique is also usable for dicing multiple project wafers, a process where dies of different dimensions are diced on the same wafer.
CitationLow-cost silicon wafer dicing using a craft cutter 2014, 21 (7):1411 Microsystem Technologies
PublisherSpringer Science + Business Media