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dc.contributor.authorThoroddsen, Sigurdur T
dc.contributor.authorNguyen, H. D.
dc.contributor.authorTakehara, K.
dc.contributor.authorEtoh, T. G.
dc.date.accessioned2015-05-18T21:55:36Z
dc.date.available2015-05-18T21:55:36Z
dc.date.issued2010-10-15
dc.identifier.citationStick-slip substructure in rapid tape peeling 2010, 82 (4) Physical Review E
dc.identifier.issn1539-3755
dc.identifier.issn1550-2376
dc.identifier.pmid21230345
dc.identifier.doi10.1103/PhysRevE.82.046107
dc.identifier.urihttp://hdl.handle.net/10754/554107
dc.description.abstractThe peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
dc.publisherAmerican Physical Society (APS)
dc.relation.urlhttp://link.aps.org/doi/10.1103/PhysRevE.82.046107
dc.rightsArchived with thanks to Physical Review E
dc.titleStick-slip substructure in rapid tape peeling
dc.typeArticle
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Division
dc.identifier.journalPhysical Review E
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionCivil and Environmental Engineering, Kinki University, Higashi-Osaka 577-8502, Japan
kaust.personThoroddsen, Sigurdur T.
refterms.dateFOA2018-06-13T12:35:06Z


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