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    Stick-slip substructure in rapid tape peeling

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    Type
    Article
    Authors
    Thoroddsen, Sigurdur T cc
    Nguyen, H. D.
    Takehara, K.
    Etoh, T. G.
    KAUST Department
    High-Speed Fluids Imaging Laboratory
    Mechanical Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2010-10-15
    Permanent link to this record
    http://hdl.handle.net/10754/554107
    
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    Abstract
    The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
    Citation
    Stick-slip substructure in rapid tape peeling 2010, 82 (4) Physical Review E
    Publisher
    American Physical Society (APS)
    Journal
    Physical Review E
    DOI
    10.1103/PhysRevE.82.046107
    PubMed ID
    21230345
    Additional Links
    http://link.aps.org/doi/10.1103/PhysRevE.82.046107
    ae974a485f413a2113503eed53cd6c53
    10.1103/PhysRevE.82.046107
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