KAUST DepartmentHigh-Speed Fluids Imaging Laboratory
Mechanical Engineering Program
Physical Science and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/554107
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AbstractThe peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
CitationStick-slip substructure in rapid tape peeling 2010, 82 (4) Physical Review E
PublisherAmerican Physical Society (APS)
JournalPhysical Review E
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- Authors: Cortet PP, Dalbe MJ, Guerra C, Cohen C, Ciccotti M, Santucci S, Vanel L
- Issue date: 2013 Feb
- Multiscale Stick-Slip Dynamics of Adhesive Tape Peeling.
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- Issue date: 2015 Sep 18
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- Authors: Dalbe MJ, Villey R, Ciccotti M, Santucci S, Cortet PP, Vanel L
- Issue date: 2016 May 18
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- Issue date: 2014 Dec 28
- Strong dynamical effects during stick-slip adhesive peeling.
- Authors: Dalbe MJ, Santucci S, Cortet PP, Vanel L
- Issue date: 2014 Jan 7