Advanced Magnetoimpedance Sensors

Abstract

This thesis is concerned with the advanced topics of thin film magnetoimpedance (MI) sensors. The author proposes and develops novel MI sensors that target on the challenges arising from emerging applications such as flexible electronics, passive wireless sensing, etc. In the study of flexible MI sensor, the investigated sensors of NiFe/Cu/NiFe tri-layersare fabricated on three flexible substrates having different surface roughness: Kapton, standard and premiumphotopaper. Sensitivity versus substrate roughness analysis is carried out for the selection of optimal substrate material. The high magnetic sensing performance is achieved by using Kapton substrate. Stress simulation, incorporated with the theory of magnetostriction effect, reveals the material composition of Ni/Fe being as a key factor of the stress dependent MI effect for the flexible MI sensors. In the development of MI-SAW device for passive wireless magnetic field sensing, NiFe/Cu/NiFe tri-layersand interdigital transducers(IDT) are designed and fabricated on a single piece of LiNbO3substrate, providing a high degree of integration and the advantage of standard microfabrication. The double-electrodeIDT has been utilized and proven to have an optimal sensing performance in comparison to the bi-directional IDT design. The optimized high frequency performance of the thin film MI sensor results in a MI-SAW passive wireless magnetic sensor with high magnetic sensitivity comparing to the MI microwire approach. Benefiting from the high degree of integration of the MI thin film element, in the following study, two additional sensing elements are integrated to the SAW device to have a multifunctional passive wireless sensor with extended temperature and humidity sensing capabilities. Analytical models havebeen developed to eliminate the crossovers of different sensing signals through additional reference IDTs, resulting in a multifunctional passive wireless sensor with the capability of detecting all three measurands individually and simultaneously.