Decal electronics for printed high performance cmos electronic systems

Handle URI:
http://hdl.handle.net/10754/626898
Title:
Decal electronics for printed high performance cmos electronic systems
Authors:
Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 ) ; Sevilla, Galo Torres; Cordero, Marlon Diaz; Kutbee, Arwa T. ( 0000-0002-1191-0101 )
Assignee:
King Abdullah University Of Science And Technology
Abstract:
High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Physical Sciences and Engineering (PSE) Division; Materials Science and Engineering Program
Issue Date:
23-Nov-2017
Submitted date:
2016-05-16
Type:
Patent
Application Number:
WO 2017199148 A1
Patent Status:
Published Application
Additional Links:
http://www.google.com/patents/WO2017199148A1; http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017199148A1&KC=A1&FT=D
Appears in Collections:
Patents

Full metadata record

DC FieldValue Language
dc.contributor.authorHussain, Muhammad Mustafaen
dc.contributor.authorSevilla, Galo Torresen
dc.contributor.authorCordero, Marlon Diazen
dc.contributor.authorKutbee, Arwa T.en
dc.date.accessioned2018-01-28T12:16:40Z-
dc.date.available2018-01-28T12:16:40Z-
dc.date.issued2017-11-23-
dc.date.submitted2016-05-16-
dc.identifier.urihttp://hdl.handle.net/10754/626898-
dc.description.abstractHigh performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.en
dc.relation.urlhttp://www.google.com/patents/WO2017199148A1en
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017199148A1&KC=A1&FT=Den
dc.titleDecal electronics for printed high performance cmos electronic systemsen
dc.typePatenten
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentMaterials Science and Engineering Programen
dc.description.statusPublished Applicationen
dc.contributor.assigneeKing Abdullah University Of Science And Technologyen
dc.description.countryWorld Intellectual Property Organization (WIPO)en
dc.identifier.applicationnumberWO 2017199148 A1en
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