Microscale solid-state thermal diodes enabling ambient temperature thermal circuits for energy applications

Handle URI:
http://hdl.handle.net/10754/626714
Title:
Microscale solid-state thermal diodes enabling ambient temperature thermal circuits for energy applications
Authors:
Wang, Song; Cottrill, Anton L.; Kunai, Yuichiro; Toland, Aubrey R.; Liu, Pingwei; Wang, Wen-Jun ( 0000-0002-9740-2924 ) ; Strano, Michael S.
Abstract:
Thermal diodes, or devices that transport thermal energy asymmetrically, analogous to electrical diodes, hold promise for thermal energy harvesting and conservation, as well as for phononics or information processing. The junction of a phase change material and phase invariant material can form a thermal diode; however, there are limited constituent materials available for a given target temperature, particularly near ambient. In this work, we demonstrate that a micro and nanoporous polystyrene foam can house a paraffin-based phase change material, fused to PMMA, to produce mechanically robust, solid-state thermal diodes capable of ambient operation with Young's moduli larger than 11.5 MPa and 55.2 MPa above and below the melting transition point, respectively. Moreover, the composites show significant changes in thermal conductivity above and below the melting point of the constituent paraffin and rectification that is well-described by our previous theory and the Maxwell–Eucken model. Maximum thermal rectifications range from 1.18 to 1.34. We show that such devices perform reliably enough to operate in thermal diode bridges, dynamic thermal circuits capable of transforming oscillating temperature inputs into single polarity temperature differences – analogous to an electrical diode bridge with widespread implications for transient thermal energy harvesting and conservation. Overall, our approach yields mechanically robust, solid-state thermal diodes capable of engineering design from a mathematical model of phase change and thermal transport, with implications for energy harvesting.
Citation:
Wang S, Cottrill AL, Kunai Y, Toland AR, Liu P, et al. (2017) Microscale solid-state thermal diodes enabling ambient temperature thermal circuits for energy applications. Physical Chemistry Chemical Physics 19: 13172–13181. Available: http://dx.doi.org/10.1039/c7cp02445b.
Publisher:
Royal Society of Chemistry (RSC)
Journal:
Phys. Chem. Chem. Phys.
KAUST Grant Number:
OSR-2015-Sensors-2700
Issue Date:
10-May-2017
DOI:
10.1039/c7cp02445b
Type:
Article
ISSN:
1463-9076; 1463-9084
Sponsors:
The authors also acknowledge the Office of Naval Research (ONR), under award N00014-16-1-2144, for support for experimental efforts to synthesize diodes and King Abdullah University of Science and Technology (KAUST), under award OSR-2015-Sensors-2700, for their financial support of applications to sensor nodes. The US Department of Energy, Office of Science, Basic Energy Sciences under Award Grant DE-FG02-08ER46488 Mod 0008 is acknowledged for support of mathematical modeling and computation relating to energy systems related to nanomaterials. The authors are thankful for the support of Lin Guangzhao & Hu Guozan Graduate Education International Exchange Fund from Zhejiang University.
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Full metadata record

DC FieldValue Language
dc.contributor.authorWang, Songen
dc.contributor.authorCottrill, Anton L.en
dc.contributor.authorKunai, Yuichiroen
dc.contributor.authorToland, Aubrey R.en
dc.contributor.authorLiu, Pingweien
dc.contributor.authorWang, Wen-Junen
dc.contributor.authorStrano, Michael S.en
dc.date.accessioned2018-01-04T07:51:41Z-
dc.date.available2018-01-04T07:51:41Z-
dc.date.issued2017-05-10en
dc.identifier.citationWang S, Cottrill AL, Kunai Y, Toland AR, Liu P, et al. (2017) Microscale solid-state thermal diodes enabling ambient temperature thermal circuits for energy applications. Physical Chemistry Chemical Physics 19: 13172–13181. Available: http://dx.doi.org/10.1039/c7cp02445b.en
dc.identifier.issn1463-9076en
dc.identifier.issn1463-9084en
dc.identifier.doi10.1039/c7cp02445ben
dc.identifier.urihttp://hdl.handle.net/10754/626714-
dc.description.abstractThermal diodes, or devices that transport thermal energy asymmetrically, analogous to electrical diodes, hold promise for thermal energy harvesting and conservation, as well as for phononics or information processing. The junction of a phase change material and phase invariant material can form a thermal diode; however, there are limited constituent materials available for a given target temperature, particularly near ambient. In this work, we demonstrate that a micro and nanoporous polystyrene foam can house a paraffin-based phase change material, fused to PMMA, to produce mechanically robust, solid-state thermal diodes capable of ambient operation with Young's moduli larger than 11.5 MPa and 55.2 MPa above and below the melting transition point, respectively. Moreover, the composites show significant changes in thermal conductivity above and below the melting point of the constituent paraffin and rectification that is well-described by our previous theory and the Maxwell–Eucken model. Maximum thermal rectifications range from 1.18 to 1.34. We show that such devices perform reliably enough to operate in thermal diode bridges, dynamic thermal circuits capable of transforming oscillating temperature inputs into single polarity temperature differences – analogous to an electrical diode bridge with widespread implications for transient thermal energy harvesting and conservation. Overall, our approach yields mechanically robust, solid-state thermal diodes capable of engineering design from a mathematical model of phase change and thermal transport, with implications for energy harvesting.en
dc.description.sponsorshipThe authors also acknowledge the Office of Naval Research (ONR), under award N00014-16-1-2144, for support for experimental efforts to synthesize diodes and King Abdullah University of Science and Technology (KAUST), under award OSR-2015-Sensors-2700, for their financial support of applications to sensor nodes. The US Department of Energy, Office of Science, Basic Energy Sciences under Award Grant DE-FG02-08ER46488 Mod 0008 is acknowledged for support of mathematical modeling and computation relating to energy systems related to nanomaterials. The authors are thankful for the support of Lin Guangzhao & Hu Guozan Graduate Education International Exchange Fund from Zhejiang University.en
dc.publisherRoyal Society of Chemistry (RSC)en
dc.titleMicroscale solid-state thermal diodes enabling ambient temperature thermal circuits for energy applicationsen
dc.typeArticleen
dc.identifier.journalPhys. Chem. Chem. Phys.en
dc.contributor.institutionState Key Lab of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, Chinaen
dc.contributor.institutionDepartment of Chemical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Ave., Cambridge, USAen
kaust.grant.numberOSR-2015-Sensors-2700en
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