3D printed System-on-Package (SoP) for environmental sensing and localization applications

Handle URI:
http://hdl.handle.net/10754/626619
Title:
3D printed System-on-Package (SoP) for environmental sensing and localization applications
Authors:
Zhen, Su; Bilal, Rana Muhammad; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.
KAUST Department:
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Citation:
Zhen S, Bilal RM, Shamim A (2017) 3D printed System-on-Package (SoP) for environmental sensing and localization applications. 2017 International Symposium on Antennas and Propagation (ISAP). Available: http://dx.doi.org/10.1109/ISANP.2017.8228793.
Publisher:
IEEE
Journal:
2017 International Symposium on Antennas and Propagation (ISAP)
Issue Date:
22-Dec-2017
DOI:
10.1109/ISANP.2017.8228793
Type:
Conference Paper
Additional Links:
http://ieeexplore.ieee.org/document/8228793/
Appears in Collections:
Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

Full metadata record

DC FieldValue Language
dc.contributor.authorZhen, Suen
dc.contributor.authorBilal, Rana Muhammaden
dc.contributor.authorShamim, Atifen
dc.date.accessioned2018-01-01T12:19:03Z-
dc.date.available2018-01-01T12:19:03Z-
dc.date.issued2017-12-22en
dc.identifier.citationZhen S, Bilal RM, Shamim A (2017) 3D printed System-on-Package (SoP) for environmental sensing and localization applications. 2017 International Symposium on Antennas and Propagation (ISAP). Available: http://dx.doi.org/10.1109/ISANP.2017.8228793.en
dc.identifier.doi10.1109/ISANP.2017.8228793en
dc.identifier.urihttp://hdl.handle.net/10754/626619-
dc.description.abstractThis paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.en
dc.publisherIEEEen
dc.relation.urlhttp://ieeexplore.ieee.org/document/8228793/en
dc.subjectAntenna radiation patternsen
dc.subjectGSMen
dc.subjectPrinted circuitsen
dc.subjectTemperature sensorsen
dc.subjectThree-dimensional displaysen
dc.title3D printed System-on-Package (SoP) for environmental sensing and localization applicationsen
dc.typeConference Paperen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journal2017 International Symposium on Antennas and Propagation (ISAP)en
kaust.authorZhen, Suen
kaust.authorBilal, Rana Muhammaden
kaust.authorShamim, Atifen
All Items in KAUST are protected by copyright, with all rights reserved, unless otherwise indicated.