Embedding complex objects with 3d printing

Handle URI:
http://hdl.handle.net/10754/626339
Title:
Embedding complex objects with 3d printing
Authors:
Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 ) ; Diaz, Cordero Marlon Steven
Assignee:
King Abdullah University Of Science And Technology
Abstract:
A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Issue Date:
12-Oct-2017
Submitted date:
2016-04-08
Type:
Patent
Application Number:
WO 2017175159 A1
Patent Status:
Published Application
Additional Links:
http://www.google.com/patents/WO2017175159A1; http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017175159A1&KC=A1&FT=D
Appears in Collections:
Patents

Full metadata record

DC FieldValue Language
dc.contributor.authorHussain, Muhammad Mustafaen
dc.contributor.authorDiaz, Cordero Marlon Stevenen
dc.date.accessioned2017-12-10T12:16:42Z-
dc.date.available2017-12-10T12:16:42Z-
dc.date.issued2017-10-12-
dc.date.submitted2016-04-08-
dc.identifier.urihttp://hdl.handle.net/10754/626339-
dc.description.abstractA CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.en
dc.relation.urlhttp://www.google.com/patents/WO2017175159A1en
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017175159A1&KC=A1&FT=Den
dc.titleEmbedding complex objects with 3d printingen
dc.typePatenten
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.description.statusPublished Applicationen
dc.contributor.assigneeKing Abdullah University Of Science And Technologyen
dc.description.countryWorld Intellectual Property Organization (WIPO)en
dc.identifier.applicationnumberWO 2017175159 A1en
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