Mechanical response of spiral interconnect arrays for highly stretchable electronics

Handle URI:
http://hdl.handle.net/10754/626281
Title:
Mechanical response of spiral interconnect arrays for highly stretchable electronics
Authors:
Qaiser, Nadeem ( 0000-0001-7417-9857 ) ; Khan, S. M.; Nour, Maha A.; Rehman, M. U. ( 0000-0003-0718-8678 ) ; Rojas, J. P.; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Integrated Disruptive Electronic Applications (IDEA) Lab; Integrated Nanotechnology Lab
Citation:
Qaiser N, Khan SM, Nour M, Rehman MU, Rojas JP, et al. (2017) Mechanical response of spiral interconnect arrays for highly stretchable electronics. Applied Physics Letters 111: 214102. Available: http://dx.doi.org/10.1063/1.5007111.
Publisher:
AIP Publishing
Journal:
Applied Physics Letters
KAUST Grant Number:
OSR-2016-KKI-2880
Issue Date:
21-Nov-2017
DOI:
10.1063/1.5007111
Type:
Article
ISSN:
0003-6951; 1077-3118
Sponsors:
This publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. We declare no competing financial interest.
Additional Links:
http://aip.scitation.org/doi/full/10.1063/1.5007111
Appears in Collections:
Articles; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorQaiser, Nadeemen
dc.contributor.authorKhan, S. M.en
dc.contributor.authorNour, Maha A.en
dc.contributor.authorRehman, M. U.en
dc.contributor.authorRojas, J. P.en
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2017-12-05T06:12:00Z-
dc.date.available2017-12-05T06:12:00Z-
dc.date.issued2017-11-21en
dc.identifier.citationQaiser N, Khan SM, Nour M, Rehman MU, Rojas JP, et al. (2017) Mechanical response of spiral interconnect arrays for highly stretchable electronics. Applied Physics Letters 111: 214102. Available: http://dx.doi.org/10.1063/1.5007111.en
dc.identifier.issn0003-6951en
dc.identifier.issn1077-3118en
dc.identifier.doi10.1063/1.5007111en
dc.identifier.urihttp://hdl.handle.net/10754/626281-
dc.description.abstractA spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.en
dc.description.sponsorshipThis publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. We declare no competing financial interest.en
dc.publisherAIP Publishingen
dc.relation.urlhttp://aip.scitation.org/doi/full/10.1063/1.5007111en
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Applied Physics Letters and may be found at http://doi.org/10.1063/1.5007111.en
dc.subjectElectronic circuitsen
dc.subject3D printingen
dc.subjectGalactic propertiesen
dc.subjectDeformationen
dc.subjectNumericalen
dc.titleMechanical response of spiral interconnect arrays for highly stretchable electronicsen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Laben
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.identifier.journalApplied Physics Lettersen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionElectrical Engineering, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabiaen
kaust.authorQaiser, Nadeemen
kaust.authorKhan, S. M.en
kaust.authorNour, Maha A.en
kaust.authorHussain, Muhammad Mustafaen
kaust.grant.numberOSR-2016-KKI-2880en
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