Sticker electronics

Handle URI:
http://hdl.handle.net/10754/625861
Title:
Sticker electronics
Authors:
Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 ) ; Torres Sevilla, Galo Andres; Diaz Cordero, Marlon Steven
Assignee:
King Abdullah University Of Science And Technology
Abstract:
Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Issue Date:
8-Sep-2017
Submitted date:
2016-02-29
Type:
Patent
Application Number:
WO 2017149455 A1
Patent Status:
Published Application
Additional Links:
http://www.google.com/patents/WO2017149455A1; http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017149455A1&KC=A1&FT=D
Appears in Collections:
Patents

Full metadata record

DC FieldValue Language
dc.contributor.authorHussain, Muhammad Mustafaen
dc.contributor.authorTorres Sevilla, Galo Andresen
dc.contributor.authorDiaz Cordero, Marlon Stevenen
dc.date.accessioned2017-10-16T12:29:54Z-
dc.date.available2017-10-16T12:29:54Z-
dc.date.issued2017-09-08-
dc.date.submitted2016-02-29-
dc.identifier.urihttp://hdl.handle.net/10754/625861-
dc.description.abstractElectronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.en
dc.relation.urlhttp://www.google.com/patents/WO2017149455A1en
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017149455A1&KC=A1&FT=Den
dc.titleSticker electronicsen
dc.typePatenten
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.description.statusPublished Applicationen
dc.contributor.assigneeKing Abdullah University Of Science And Technologyen
dc.description.countryWorld Intellectual Property Organization (WIPO)en
dc.identifier.applicationnumberWO 2017149455 A1en
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