Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics

Handle URI:
http://hdl.handle.net/10754/623833
Title:
Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics
Authors:
Gumus, Abdurrahman; Alam, Arsalan; Hussain, Aftab M. ( 0000-0002-9516-9428 ) ; Mishra, Kush; Wicaksono, Irmandy; Sevilla, Galo T. ( 0000-0002-9419-4437 ) ; Shaikh, Sohail F. ( 0000-0001-7640-0105 ) ; Diaz, Marlon; Velling, Seneca; Ghoneim, Mohamed T. ( 0000-0002-5568-5284 ) ; Ahmed, Sally; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high-performance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Physical Sciences and Engineering (PSE) Division; Mechanical Engineering Program; Integrated Disruptive Electronic Applications (IDEA) Lab; Integrated Nanotechnology Lab
Citation:
Gumus A, Alam A, Hussain AM, Mishra K, Wicaksono I, et al. (2017) Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics. Advanced Materials Technologies 2: 1600264. Available: http://dx.doi.org/10.1002/admt.201600264.
Publisher:
Wiley-Blackwell
Journal:
Advanced Materials Technologies
KAUST Grant Number:
GEN-01-4014; OSR-2015-Sensors-2707; OSR-2016-KKI-2880
Issue Date:
29-Mar-2017
DOI:
10.1002/admt.201600264
Type:
Article
ISSN:
2365-709X
Sponsors:
This publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Technology Transfer Office (TTO) under Award No. Proof of Concept GEN-01-4014, Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR-2015-Sensors-2707 and KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. A.G., A.A., and A.M.H. contributed equally to this work. M.M.H. conceptualized the study. A.G. led and carried the study (materials, design, processes, device, integration, characterization, and data analysis). A.A. carried out all FEA analysis. A.G., A.A., and A.M.H. developed all the devices. K.M. and I.W. developed all the circuitry. G.A.T.S. developed the software and app. M.D. supported packaging. S.F.S., S.V., S.M.A., and M.T.G. assisted in characterization. Every author reviewed the manuscript independently, provided feedback, and approved the final version.
Additional Links:
http://onlinelibrary.wiley.com/doi/10.1002/admt.201600264/full
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Mechanical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorGumus, Abdurrahmanen
dc.contributor.authorAlam, Arsalanen
dc.contributor.authorHussain, Aftab M.en
dc.contributor.authorMishra, Kushen
dc.contributor.authorWicaksono, Irmandyen
dc.contributor.authorSevilla, Galo T.en
dc.contributor.authorShaikh, Sohail F.en
dc.contributor.authorDiaz, Marlonen
dc.contributor.authorVelling, Senecaen
dc.contributor.authorGhoneim, Mohamed T.en
dc.contributor.authorAhmed, Sallyen
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2017-05-31T11:23:08Z-
dc.date.available2017-05-31T11:23:08Z-
dc.date.issued2017-03-29en
dc.identifier.citationGumus A, Alam A, Hussain AM, Mishra K, Wicaksono I, et al. (2017) Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics. Advanced Materials Technologies 2: 1600264. Available: http://dx.doi.org/10.1002/admt.201600264.en
dc.identifier.issn2365-709Xen
dc.identifier.doi10.1002/admt.201600264en
dc.identifier.urihttp://hdl.handle.net/10754/623833-
dc.description.abstractIn today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high-performance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.en
dc.description.sponsorshipThis publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Technology Transfer Office (TTO) under Award No. Proof of Concept GEN-01-4014, Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR-2015-Sensors-2707 and KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. A.G., A.A., and A.M.H. contributed equally to this work. M.M.H. conceptualized the study. A.G. led and carried the study (materials, design, processes, device, integration, characterization, and data analysis). A.A. carried out all FEA analysis. A.G., A.A., and A.M.H. developed all the devices. K.M. and I.W. developed all the circuitry. G.A.T.S. developed the software and app. M.D. supported packaging. S.F.S., S.V., S.M.A., and M.T.G. assisted in characterization. Every author reviewed the manuscript independently, provided feedback, and approved the final version.en
dc.publisherWiley-Blackwellen
dc.relation.urlhttp://onlinelibrary.wiley.com/doi/10.1002/admt.201600264/fullen
dc.rightsThis is the peer reviewed version of the following article: Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics, which has been published in final form at http://doi.org/10.1002/admt.201600264. This article may be used for non-commercial purposes in accordance With Wiley Terms and Conditions for self-archiving.en
dc.subjectCMOSen
dc.subjectdestructible electronicsen
dc.subjectexpandable polymersen
dc.titleExpandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronicsen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentMechanical Engineering Programen
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Laben
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.identifier.journalAdvanced Materials Technologiesen
dc.eprint.versionPost-printen
dc.contributor.institutionElectrical Engineering; University of California at Los Angeles; Los Angeles CA 90095 USAen
dc.contributor.institutionElectrical Engineering and Information Technology; Swiss Federal Institute of Technology (ETH); Rämistrasse 101 8092 Zürich Switzerlanden
dc.contributor.institutionMechanical Engineering; University of Waterloo; 110 Columbia Street Waterloo ON N2L 3K8 Canadaen
kaust.authorGumus, Abdurrahmanen
kaust.authorHussain, Aftab M.en
kaust.authorMishra, Kushen
kaust.authorSevilla, Galo T.en
kaust.authorShaikh, Sohail F.en
kaust.authorDiaz, Marlonen
kaust.authorVelling, Senecaen
kaust.authorGhoneim, Mohamed T.en
kaust.authorAhmed, Sallyen
kaust.authorHussain, Muhammad Mustafaen
kaust.grant.numberGEN-01-4014en
kaust.grant.numberOSR-2015-Sensors-2707en
kaust.grant.numberOSR-2016-KKI-2880en
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