Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices

Handle URI:
http://hdl.handle.net/10754/623683
Title:
Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices
Authors:
O'Dwyer, Colm ( 0000-0001-7429-015X ) ; Chen, Renkun; He, Jr-Hau ( 0000-0003-1886-9241 ) ; Lee, Jaeho; Razeeb, Kafil M.
Abstract:
This paper considers the state-of-the-art and open scientific and technological questions in thermoelectric materials and devices, from phonon engineering and scattering methods, to new and complex materials and their thermoelectric behavior. The paper also describes recent approaches to create structural and compositional material systems designed to enhance the thermoelectric figure of merit and power factors. We also summarize and contextualize recent advances in the use of superlattice structures and porosity or roughness to influence phonon scattering mechanisms and detail some advances in integrated thermoelectric materials for generators and coolers for thermally stable photonic devices.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; KAUST Solar Center (KSC)
Citation:
O’Dwyer C, Chen R, He J-H, Lee J, Razeeb KM (2017) Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices. ECS Journal of Solid State Science and Technology 6: N3058–N3064. Available: http://dx.doi.org/10.1149/2.0091703jss.
Publisher:
The Electrochemical Society
Journal:
ECS Journal of Solid State Science and Technology
Issue Date:
19-Jan-2017
DOI:
10.1149/2.0091703jss
Type:
Article
ISSN:
2162-8769; 2162-8777
Sponsors:
This work was also supported by Science Foundation Ireland (SFI) through Technology Innovation and Development Awards 2013 and 2015 under contracts 13/TIDA/E2761 and 15/TIDA/2893. This publication has also emanated from research supported in part by a research grant from SFI under grant Number 14/IA/2581. This work has received funding from the European Union's Horizon2020 funded project “Thermally Integrated Smart Photonics Systems (TIPS)”, under the grant agreement No. 644453.
Additional Links:
http://jss.ecsdl.org/content/6/3/N3058.full
Appears in Collections:
Articles; Electrical Engineering Program; KAUST Solar Center (KSC); Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorO'Dwyer, Colmen
dc.contributor.authorChen, Renkunen
dc.contributor.authorHe, Jr-Hauen
dc.contributor.authorLee, Jaehoen
dc.contributor.authorRazeeb, Kafil M.en
dc.date.accessioned2017-05-22T06:58:04Z-
dc.date.available2017-05-22T06:58:04Z-
dc.date.issued2017-01-19en
dc.identifier.citationO’Dwyer C, Chen R, He J-H, Lee J, Razeeb KM (2017) Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices. ECS Journal of Solid State Science and Technology 6: N3058–N3064. Available: http://dx.doi.org/10.1149/2.0091703jss.en
dc.identifier.issn2162-8769en
dc.identifier.issn2162-8777en
dc.identifier.doi10.1149/2.0091703jssen
dc.identifier.urihttp://hdl.handle.net/10754/623683-
dc.description.abstractThis paper considers the state-of-the-art and open scientific and technological questions in thermoelectric materials and devices, from phonon engineering and scattering methods, to new and complex materials and their thermoelectric behavior. The paper also describes recent approaches to create structural and compositional material systems designed to enhance the thermoelectric figure of merit and power factors. We also summarize and contextualize recent advances in the use of superlattice structures and porosity or roughness to influence phonon scattering mechanisms and detail some advances in integrated thermoelectric materials for generators and coolers for thermally stable photonic devices.en
dc.description.sponsorshipThis work was also supported by Science Foundation Ireland (SFI) through Technology Innovation and Development Awards 2013 and 2015 under contracts 13/TIDA/E2761 and 15/TIDA/2893. This publication has also emanated from research supported in part by a research grant from SFI under grant Number 14/IA/2581. This work has received funding from the European Union's Horizon2020 funded project “Thermally Integrated Smart Photonics Systems (TIPS)”, under the grant agreement No. 644453.en
dc.publisherThe Electrochemical Societyen
dc.relation.urlhttp://jss.ecsdl.org/content/6/3/N3058.fullen
dc.rightsThis is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in any way and is properly cited. For permission for commercial reuse, please email: oa@electrochem.org.en
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.titleScientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devicesen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentKAUST Solar Center (KSC)en
dc.identifier.journalECS Journal of Solid State Science and Technologyen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionDepartment of Chemistry, University College Cork, Cork T12 YN60, Irelanden
dc.contributor.institutionTyndall National Institute, University College Cork, Cork T12 R5CP, Irelanden
dc.contributor.institutionDepartment of Mechanical and Aerospace Engineering, University of California, San Diego, La Jolla, California 92093-0411, USAen
dc.contributor.institutionDepartment of Mechanical and Aerospace Engineering, University of California, Irvine, Irvine, California 92697-2625, USAen
kaust.authorHe, Jr-Hauen
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