Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method

Handle URI:
http://hdl.handle.net/10754/623216
Title:
Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Authors:
Li, Ping; Dong, Yilin; Tang, Min; Mao, Junfa; Jiang, Li Jun; Bagci, Hakan ( 0000-0003-3867-5786 )
Abstract:
Since accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.
KAUST Department:
Department of Electronic Engineering, King Abdullah University of Science and Technology, Thuwal 23955, Saudi Arabia.
Citation:
Li P, Dong Y, Tang M, Mao J, Jiang LJ, et al. (2017) Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method. IEEE Transactions on Components, Packaging and Manufacturing Technology: 1–10. Available: http://dx.doi.org/10.1109/TCPMT.2017.2666259.
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue Date:
11-Mar-2017
DOI:
10.1109/TCPMT.2017.2666259
Type:
Article
ISSN:
2156-3950; 2156-3985
Sponsors:
This work was supported in part by the National Science Foundation of China under Grant 61234001 and Grant 61674105 and in part by the University Grants Council of Hong Kong under Contract AoE/P-04/08. Recommended for publication by Associate Editor
Additional Links:
http://ieeexplore.ieee.org/document/7875407/
Appears in Collections:
Articles

Full metadata record

DC FieldValue Language
dc.contributor.authorLi, Pingen
dc.contributor.authorDong, Yilinen
dc.contributor.authorTang, Minen
dc.contributor.authorMao, Junfaen
dc.contributor.authorJiang, Li Junen
dc.contributor.authorBagci, Hakanen
dc.date.accessioned2017-04-13T11:51:01Z-
dc.date.available2017-04-13T11:51:01Z-
dc.date.issued2017-03-11en
dc.identifier.citationLi P, Dong Y, Tang M, Mao J, Jiang LJ, et al. (2017) Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method. IEEE Transactions on Components, Packaging and Manufacturing Technology: 1–10. Available: http://dx.doi.org/10.1109/TCPMT.2017.2666259.en
dc.identifier.issn2156-3950en
dc.identifier.issn2156-3985en
dc.identifier.doi10.1109/TCPMT.2017.2666259en
dc.identifier.urihttp://hdl.handle.net/10754/623216-
dc.description.abstractSince accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.en
dc.description.sponsorshipThis work was supported in part by the National Science Foundation of China under Grant 61234001 and Grant 61674105 and in part by the University Grants Council of Hong Kong under Contract AoE/P-04/08. Recommended for publication by Associate Editoren
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.urlhttp://ieeexplore.ieee.org/document/7875407/en
dc.subjecttransient thermal analysisen
dc.subjectAuxiliary-differential equation (ADE) methoden
dc.subjectdiscontinuous Galerkin time-domain (DGTD) methoden
dc.subjectintegrated circuit packageen
dc.subjectnumerical fluxen
dc.titleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Methoden
dc.typeArticleen
dc.contributor.departmentDepartment of Electronic Engineering, King Abdullah University of Science and Technology, Thuwal 23955, Saudi Arabia.en
dc.identifier.journalIEEE Transactions on Components, Packaging and Manufacturing Technologyen
dc.contributor.institutionDepartment of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47906 USA.en
dc.contributor.institutionDepartment of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong.en
dc.contributor.institutionDepartment of Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.en
kaust.authorBagci, Hakanen
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