Stretchable and foldable silicon-based electronics

Handle URI:
http://hdl.handle.net/10754/623109
Title:
Stretchable and foldable silicon-based electronics
Authors:
Cavazos Sepulveda, Adrian Cesar ( 0000-0002-4258-5065 ) ; Diaz Cordero, M. S.; Carreno, Armando Arpys Arevalo ( 0000-0001-9446-3310 ) ; Nassar, Joanna M. ( 0000-0003-4463-8877 ) ; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
Flexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
KAUST Department:
Integrated Disruptive Electronic Applications (IDEA) Lab; Integrated Nanotechnology Lab; Materials Science and Engineering Program; Physical Sciences and Engineering (PSE) Division; Mechanical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Citation:
Cavazos Sepulveda AC, Diaz Cordero MS, Carreño AAA, Nassar JM, Hussain MM (2017) Stretchable and foldable silicon-based electronics. Applied Physics Letters 110: 134103. Available: http://dx.doi.org/10.1063/1.4979545.
Publisher:
AIP Publishing
Journal:
Applied Physics Letters
Issue Date:
30-Mar-2017
DOI:
10.1063/1.4979545
Type:
Article
ISSN:
0003-6951; 1077-3118
Sponsors:
The research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.
Additional Links:
http://aip.scitation.org/doi/10.1063/1.4979545
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Materials Science and Engineering Program; Mechanical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorCavazos Sepulveda, Adrian Cesaren
dc.contributor.authorDiaz Cordero, M. S.en
dc.contributor.authorCarreno, Armando Arpys Arevaloen
dc.contributor.authorNassar, Joanna M.en
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2017-04-10T07:49:52Z-
dc.date.available2017-04-10T07:49:52Z-
dc.date.issued2017-03-30en
dc.identifier.citationCavazos Sepulveda AC, Diaz Cordero MS, Carreño AAA, Nassar JM, Hussain MM (2017) Stretchable and foldable silicon-based electronics. Applied Physics Letters 110: 134103. Available: http://dx.doi.org/10.1063/1.4979545.en
dc.identifier.issn0003-6951en
dc.identifier.issn1077-3118en
dc.identifier.doi10.1063/1.4979545en
dc.identifier.urihttp://hdl.handle.net/10754/623109-
dc.description.abstractFlexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.en
dc.description.sponsorshipThe research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.en
dc.publisherAIP Publishingen
dc.relation.urlhttp://aip.scitation.org/doi/10.1063/1.4979545en
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Applied Physics Letters and may be found at http://doi.org/10.1063/1.4979545.en
dc.titleStretchable and foldable silicon-based electronicsen
dc.typeArticleen
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Laben
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.contributor.departmentMaterials Science and Engineering Programen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentMechanical Engineering Programen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalApplied Physics Lettersen
dc.eprint.versionPublisher's Version/PDFen
kaust.authorCavazos Sepulveda, Adrian Cesaren
kaust.authorDiaz Cordero, M. S.en
kaust.authorCarreno, Armando Arpys Arevaloen
kaust.authorNassar, Joanna M.en
kaust.authorHussain, Muhammad Mustafaen
All Items in KAUST are protected by copyright, with all rights reserved, unless otherwise indicated.