Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

Handle URI:
http://hdl.handle.net/10754/622546
Title:
Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates
Authors:
Kim, Sangkil; Shamim, Atif ( 0000-0002-4207-4740 ) ; Georgiadis, Apostolos; Aubert, Herve; Tentzeris, Manos M.
Abstract:
In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Citation:
Kim S, Shamim A, Georgiadis A, Aubert H, Tentzeris MM (2016) Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates. IEEE Transactions on Components, Packaging and Manufacturing Technology 6: 486–496. Available: http://dx.doi.org/10.1109/TCPMT.2016.2522461.
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue Date:
11-Feb-2016
DOI:
10.1109/TCPMT.2016.2522461
Type:
Article
ISSN:
2156-3950; 2156-3985
Sponsors:
The work of S. Kim and M. Tentzeris was supported by NSF and DTRA. The work of A. Georgiadis has been supported by the EU COST Action IC1301 WiPE Wireless Power Transmission for Sustainable Electronics, the Generalitat de Catalunya under Grant 2014 SGR 1551 and by EU H2020 Marie Sklodowska-Curie grant agreement No 661621. Recommended for publication by Associate Editor A. Shapiro upon evaluation of reviewers' comments.
Additional Links:
http://ieeexplore.ieee.org/document/7405313
Appears in Collections:
Articles; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorKim, Sangkilen
dc.contributor.authorShamim, Atifen
dc.contributor.authorGeorgiadis, Apostolosen
dc.contributor.authorAubert, Herveen
dc.contributor.authorTentzeris, Manos M.en
dc.date.accessioned2017-01-02T09:55:29Z-
dc.date.available2017-01-02T09:55:29Z-
dc.date.issued2016-02-11en
dc.identifier.citationKim S, Shamim A, Georgiadis A, Aubert H, Tentzeris MM (2016) Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates. IEEE Transactions on Components, Packaging and Manufacturing Technology 6: 486–496. Available: http://dx.doi.org/10.1109/TCPMT.2016.2522461.en
dc.identifier.issn2156-3950en
dc.identifier.issn2156-3985en
dc.identifier.doi10.1109/TCPMT.2016.2522461en
dc.identifier.urihttp://hdl.handle.net/10754/622546-
dc.description.abstractIn this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.en
dc.description.sponsorshipThe work of S. Kim and M. Tentzeris was supported by NSF and DTRA. The work of A. Georgiadis has been supported by the EU COST Action IC1301 WiPE Wireless Power Transmission for Sustainable Electronics, the Generalitat de Catalunya under Grant 2014 SGR 1551 and by EU H2020 Marie Sklodowska-Curie grant agreement No 661621. Recommended for publication by Associate Editor A. Shapiro upon evaluation of reviewers' comments.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.urlhttp://ieeexplore.ieee.org/document/7405313en
dc.subjectAdditive fabricationen
dc.subjectinkjet-printed substrate-integrated waveguide (SIW)en
dc.subjectinkjet-printed viaen
dc.subjectlow-cost via fabricationen
dc.subjectpolymethyl methacrylate (PMMA).en
dc.titleFabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substratesen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalIEEE Transactions on Components, Packaging and Manufacturing Technologyen
dc.contributor.institutionQualcomm, San Diego, CA, 92121, United Statesen
dc.contributor.institutionCentre Tecnologic de Telecomunicacions de Catalunya, Barcelona, 08860, Spainen
dc.contributor.institutionLaboratory for the Analysis and Architecture of Systems, Natl. Ctr. for Scientific Research, Micro and Nanosystems for Wireless Communications Research Group, Toulouse, 31400, Franceen
dc.contributor.institutionSchool of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, United Statesen
kaust.authorShamim, Atifen
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