Polyimide and Metals MEMS Multi-User Processes

Handle URI:
http://hdl.handle.net/10754/621944
Title:
Polyimide and Metals MEMS Multi-User Processes
Authors:
Arevalo, Arpys ( 0000-0001-9446-3310 )
Abstract:
The development of a polyimide and metals multi-user surface micro-machining process for Micro-electro-mechanical Systems (MEMS) is presented. The process was designed to be as general as possible, and designed to be capable to fabricate different designs on a single silicon wafer. The process was not optimized with the purpose of fabricating any one specific device but can be tweaked to satisfy individual needs depending on the application. The fabrication process uses Polyimide as the structural material and three separated metallization layers that can be interconnected depending on the desired application. The technology allows the development of out-of-plane compliant mechanisms, which can be combined with six variations of different physical principles for actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception.
Advisors:
Foulds, Ian G.; Kosel, Jürgen ( 0000-0002-8998-8275 )
Committee Member:
Younis, Mohammad I. ( 0000-0002-9491-1838 ) ; Bohringer, Karl
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Program:
Electrical Engineering
Issue Date:
Nov-2016
Type:
Dissertation
Appears in Collections:
Dissertations

Full metadata record

DC FieldValue Language
dc.contributor.advisorFoulds, Ian G.en
dc.contributor.advisorKosel, Jürgenen
dc.contributor.authorArevalo, Arpysen
dc.date.accessioned2016-12-05T12:55:43Z-
dc.date.available2016-12-05T12:55:43Z-
dc.date.issued2016-11-
dc.identifier.urihttp://hdl.handle.net/10754/621944-
dc.description.abstractThe development of a polyimide and metals multi-user surface micro-machining process for Micro-electro-mechanical Systems (MEMS) is presented. The process was designed to be as general as possible, and designed to be capable to fabricate different designs on a single silicon wafer. The process was not optimized with the purpose of fabricating any one specific device but can be tweaked to satisfy individual needs depending on the application. The fabrication process uses Polyimide as the structural material and three separated metallization layers that can be interconnected depending on the desired application. The technology allows the development of out-of-plane compliant mechanisms, which can be combined with six variations of different physical principles for actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception.en
dc.language.isoenen
dc.subjectMEMSen
dc.subjectMicrofabricationen
dc.subjectPolyimideen
dc.subjectPZTen
dc.subjectMulti-user processesen
dc.subjectMicro-loudspeakeren
dc.titlePolyimide and Metals MEMS Multi-User Processesen
dc.typeDissertationen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
thesis.degree.grantorKing Abdullah University of Science and Technologyen_GB
dc.contributor.committeememberYounis, Mohammad I.en
dc.contributor.committeememberBohringer, Karlen
thesis.degree.disciplineElectrical Engineeringen
thesis.degree.nameDoctor of Philosophyen
dc.person.id101847en
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