Handle URI:
http://hdl.handle.net/10754/597921
Title:
Decohesion Kinetics of PEDOT:PSS Conducting Polymer Films
Authors:
Dupont, Stephanie R.; Novoa, Fernando; Voroshazi, Eszter; Dauskardt, Reinhold H.
Abstract:
The highly conductive polymer PEDOT:PSS is a widely used hole transport layer and transparent electrode in organic electronic devices. To date, the mechanical and fracture properties of this conductive polymer layer are not well understood. Notably, the decohesion rate of the PEDOT:PSS layer and its sensitivity to moist environments has not been reported, which is central in determining the lifetimes of organic electronic devices. Here, it is demonstrated that the decohesion rate is highly sensitive to the ambient moisture content, temperature, and mechanical stress. The kinetic mechanisms are elucidated using atomistic bond rupture models and the decohesion process is shown to be facilitated by a chemical reaction between water molecules from the environment and strained hydrogen bonds. Hydrogen bonds are the predominant bonding mechanism between individual PEDOT:PSS grains within the layer and cause a significant loss in cohesion when they are broken. Understanding the decohesion kinetics and mechanisms in these films is essential for the mechanical integrity of devices containing PEDOT:PSS layers and yields general guidelines for the design of more reliable organic electronic devices. Decohesion rate in PEDOT:PSS conducting films is studied under varied environmental conditions. The moisture content in the environment is the most important factor accelerating the decohesion in the PEDOT:PSS layer, which is detrimental for device reliability. The findings on the decohesion rate and mechanisms, elucidated by atomic kinetic models, are essential for the design of more reliable organic electronic devices containting PEDOT:PSS layers. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Citation:
Dupont SR, Novoa F, Voroshazi E, Dauskardt RH (2013) Decohesion Kinetics of PEDOT:PSS Conducting Polymer Films. Advanced Functional Materials 24: 1325–1332. Available: http://dx.doi.org/10.1002/adfm.201302174.
Publisher:
Wiley-Blackwell
Journal:
Advanced Functional Materials
KAUST Grant Number:
KUS-C1-015-21
Issue Date:
17-Oct-2013
DOI:
10.1002/adfm.201302174
Type:
Article
ISSN:
1616-301X
Sponsors:
This research was supported by the Center for Advanced Molecular Photovoltaics (CAMP) supported by King Abdullah University of Science and Technology (KAUST) under award no. KUS-C1-015-21.
Appears in Collections:
Publications Acknowledging KAUST Support

Full metadata record

DC FieldValue Language
dc.contributor.authorDupont, Stephanie R.en
dc.contributor.authorNovoa, Fernandoen
dc.contributor.authorVoroshazi, Eszteren
dc.contributor.authorDauskardt, Reinhold H.en
dc.date.accessioned2016-02-25T12:58:55Zen
dc.date.available2016-02-25T12:58:55Zen
dc.date.issued2013-10-17en
dc.identifier.citationDupont SR, Novoa F, Voroshazi E, Dauskardt RH (2013) Decohesion Kinetics of PEDOT:PSS Conducting Polymer Films. Advanced Functional Materials 24: 1325–1332. Available: http://dx.doi.org/10.1002/adfm.201302174.en
dc.identifier.issn1616-301Xen
dc.identifier.doi10.1002/adfm.201302174en
dc.identifier.urihttp://hdl.handle.net/10754/597921en
dc.description.abstractThe highly conductive polymer PEDOT:PSS is a widely used hole transport layer and transparent electrode in organic electronic devices. To date, the mechanical and fracture properties of this conductive polymer layer are not well understood. Notably, the decohesion rate of the PEDOT:PSS layer and its sensitivity to moist environments has not been reported, which is central in determining the lifetimes of organic electronic devices. Here, it is demonstrated that the decohesion rate is highly sensitive to the ambient moisture content, temperature, and mechanical stress. The kinetic mechanisms are elucidated using atomistic bond rupture models and the decohesion process is shown to be facilitated by a chemical reaction between water molecules from the environment and strained hydrogen bonds. Hydrogen bonds are the predominant bonding mechanism between individual PEDOT:PSS grains within the layer and cause a significant loss in cohesion when they are broken. Understanding the decohesion kinetics and mechanisms in these films is essential for the mechanical integrity of devices containing PEDOT:PSS layers and yields general guidelines for the design of more reliable organic electronic devices. Decohesion rate in PEDOT:PSS conducting films is studied under varied environmental conditions. The moisture content in the environment is the most important factor accelerating the decohesion in the PEDOT:PSS layer, which is detrimental for device reliability. The findings on the decohesion rate and mechanisms, elucidated by atomic kinetic models, are essential for the design of more reliable organic electronic devices containting PEDOT:PSS layers. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.en
dc.description.sponsorshipThis research was supported by the Center for Advanced Molecular Photovoltaics (CAMP) supported by King Abdullah University of Science and Technology (KAUST) under award no. KUS-C1-015-21.en
dc.publisherWiley-Blackwellen
dc.subjectadhesion and cohesionen
dc.subjectconjugated conducting polymersen
dc.subjectorganic electronicsen
dc.subjectreliabilityen
dc.subjectthin film mechanicsen
dc.titleDecohesion Kinetics of PEDOT:PSS Conducting Polymer Filmsen
dc.typeArticleen
dc.identifier.journalAdvanced Functional Materialsen
dc.contributor.institutionDepartment of Materials Science and Engineering; Stanford University; Stanford CA 94305-2205 USAen
dc.contributor.institutionIMEC vzw; Kapeldreef 75 3000 Leuven Belgiumen
kaust.grant.numberKUS-C1-015-21en
kaust.grant.fundedcenterCenter for Advanced Molecular Photovoltaics (CAMP)en
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