Handle URI:
http://hdl.handle.net/10754/597893
Title:
Creep of parylene-C film
Authors:
Lin, Jeffrey Chun-Hui; Deng, Peigang; Lam, Gilbert; Lu, Bo; Lee, Yi-Kuen; Tai, Yu-Chong
Abstract:
The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger's model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there's little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes. © 2011 IEEE.
Citation:
Lin JC-H, Deng P, Lam G, Lu B, Lee Y-K, et al. (2011) Creep of parylene-C film. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. Available: http://dx.doi.org/10.1109/transducers.2011.5969483.
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference
KAUST Grant Number:
SA-C0040/UK-C0016
Issue Date:
Jun-2011
DOI:
10.1109/transducers.2011.5969483
Type:
Conference Paper
Sponsors:
This work is supported by Biomimetic MicroElectronic Systems (BMES) and partially supported by KAUST Award No. SA-C0040/UK-C0016. The authors would like to thank Trevor Roper's help in terms of sample preparation, machines' maintenance, and instrument's installation.
Appears in Collections:
Publications Acknowledging KAUST Support

Full metadata record

DC FieldValue Language
dc.contributor.authorLin, Jeffrey Chun-Huien
dc.contributor.authorDeng, Peigangen
dc.contributor.authorLam, Gilberten
dc.contributor.authorLu, Boen
dc.contributor.authorLee, Yi-Kuenen
dc.contributor.authorTai, Yu-Chongen
dc.date.accessioned2016-02-25T12:58:28Zen
dc.date.available2016-02-25T12:58:28Zen
dc.date.issued2011-06en
dc.identifier.citationLin JC-H, Deng P, Lam G, Lu B, Lee Y-K, et al. (2011) Creep of parylene-C film. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. Available: http://dx.doi.org/10.1109/transducers.2011.5969483.en
dc.identifier.doi10.1109/transducers.2011.5969483en
dc.identifier.urihttp://hdl.handle.net/10754/597893en
dc.description.abstractThe glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger's model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there's little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes. © 2011 IEEE.en
dc.description.sponsorshipThis work is supported by Biomimetic MicroElectronic Systems (BMES) and partially supported by KAUST Award No. SA-C0040/UK-C0016. The authors would like to thank Trevor Roper's help in terms of sample preparation, machines' maintenance, and instrument's installation.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectCreepen
dc.subjectglass transition temperatureen
dc.subjectparylene-Cen
dc.subjectviscoelasticityen
dc.titleCreep of parylene-C filmen
dc.typeConference Paperen
dc.identifier.journal2011 16th International Solid-State Sensors, Actuators and Microsystems Conferenceen
dc.contributor.institutionCalifornia Institute of Technology, Pasadena, United Statesen
dc.contributor.institutionHong Kong University of Science and Technology, Hong Kong, Chinaen
dc.contributor.institutionUniversity of California, San Diego, San Diego, United Statesen
kaust.grant.numberSA-C0040/UK-C0016en
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