Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

Handle URI:
http://hdl.handle.net/10754/597884
Title:
Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems
Authors:
Sallam, M. O.; Soliman, E. A.
Abstract:
In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.
Citation:
Sallam MO, Soliman EA (2013) Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems. 2013 International Workshop on Antenna Technology (iWAT). Available: http://dx.doi.org/10.1109/IWAT.2013.6518341.
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2013 International Workshop on Antenna Technology (iWAT)
KAUST Grant Number:
UK-C0015 OUK
Issue Date:
Mar-2013
DOI:
10.1109/IWAT.2013.6518341
Type:
Conference Paper
Sponsors:
This publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST).
Appears in Collections:
Publications Acknowledging KAUST Support

Full metadata record

DC FieldValue Language
dc.contributor.authorSallam, M. O.en
dc.contributor.authorSoliman, E. A.en
dc.date.accessioned2016-02-25T12:58:19Zen
dc.date.available2016-02-25T12:58:19Zen
dc.date.issued2013-03en
dc.identifier.citationSallam MO, Soliman EA (2013) Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems. 2013 International Workshop on Antenna Technology (iWAT). Available: http://dx.doi.org/10.1109/IWAT.2013.6518341.en
dc.identifier.doi10.1109/IWAT.2013.6518341en
dc.identifier.urihttp://hdl.handle.net/10754/597884en
dc.description.abstractIn this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.en
dc.description.sponsorshipThis publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST).en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.titleCorporate array of micromachined dipoles on silicon wafer for 60 GHz communication systemsen
dc.typeConference Paperen
dc.identifier.journal2013 International Workshop on Antenna Technology (iWAT)en
dc.contributor.institutionAmerican University in Cairo, Cairo, Egypten
kaust.grant.numberUK-C0015 OUKen
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