Handle URI:
http://hdl.handle.net/10754/597883
Title:
Core-shell magnetic nanoparticles for on-chip RF inductors
Authors:
Koh, Kisik; Park, Jeaneun; Park, Jungwon; Zhu, Xu; Lin, Liwei
Abstract:
FeNi3 based core-shell magnetic nanoparticles are demonstrated as the magnetic core material for on-chip, radio frequency (RF) inductors. FeNi3 nanoparticles with 50-150 nm in diameter with 15-20 nm-thick SiO2 coating are chemically synthesized and deposited on a planar inductor as the magnetic core to enhance both inductance (L) and quality factor (Q) of the inductor. Experimentally, the ferromagnetic resonant frequency of the on-chip inductors based on FeNi3 core-shell nanoparticles has been shown to be over several GHz. A post-CMOS process has been developed to integrate the magnetic nanoparticles to a planar inductor and inductance enhancements up to 50% of the original magnitude with slightly enhanced Q-factor up to 1 GHz have been achieved. © 2013 IEEE.
Citation:
Koh K, Park J, Park J, Zhu X, Lin L (2013) Core-shell magnetic nanoparticles for on-chip RF inductors. 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS). Available: http://dx.doi.org/10.1109/MEMSYS.2013.6474279.
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)
Issue Date:
Jan-2013
DOI:
10.1109/MEMSYS.2013.6474279
Type:
Conference Paper
Sponsors:
This work was supported in part by an Academic Excellence Alliance grant awarded by the KAUST (King Abdullah University of Science and Technology) Office of Competitive Research Fund, the DARPA N/MEMS program and a SRC (Semiconductor Research Corporation) grant. The authors would like to thank Dr. Kevin O'Brien, Jun-Chau Chien and Chia Meng Chen for valuable discussions.
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Full metadata record

DC FieldValue Language
dc.contributor.authorKoh, Kisiken
dc.contributor.authorPark, Jeaneunen
dc.contributor.authorPark, Jungwonen
dc.contributor.authorZhu, Xuen
dc.contributor.authorLin, Liweien
dc.date.accessioned2016-02-25T12:58:18Zen
dc.date.available2016-02-25T12:58:18Zen
dc.date.issued2013-01en
dc.identifier.citationKoh K, Park J, Park J, Zhu X, Lin L (2013) Core-shell magnetic nanoparticles for on-chip RF inductors. 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS). Available: http://dx.doi.org/10.1109/MEMSYS.2013.6474279.en
dc.identifier.doi10.1109/MEMSYS.2013.6474279en
dc.identifier.urihttp://hdl.handle.net/10754/597883en
dc.description.abstractFeNi3 based core-shell magnetic nanoparticles are demonstrated as the magnetic core material for on-chip, radio frequency (RF) inductors. FeNi3 nanoparticles with 50-150 nm in diameter with 15-20 nm-thick SiO2 coating are chemically synthesized and deposited on a planar inductor as the magnetic core to enhance both inductance (L) and quality factor (Q) of the inductor. Experimentally, the ferromagnetic resonant frequency of the on-chip inductors based on FeNi3 core-shell nanoparticles has been shown to be over several GHz. A post-CMOS process has been developed to integrate the magnetic nanoparticles to a planar inductor and inductance enhancements up to 50% of the original magnitude with slightly enhanced Q-factor up to 1 GHz have been achieved. © 2013 IEEE.en
dc.description.sponsorshipThis work was supported in part by an Academic Excellence Alliance grant awarded by the KAUST (King Abdullah University of Science and Technology) Office of Competitive Research Fund, the DARPA N/MEMS program and a SRC (Semiconductor Research Corporation) grant. The authors would like to thank Dr. Kevin O'Brien, Jun-Chau Chien and Chia Meng Chen for valuable discussions.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.titleCore-shell magnetic nanoparticles for on-chip RF inductorsen
dc.typeConference Paperen
dc.identifier.journal2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)en
dc.contributor.institutionUC Berkeley, Berkeley, United Statesen
dc.contributor.institutionHarvard University, Cambridge, United Statesen
dc.contributor.institutionSamsung Electronics, Seoul, South Koreaen
kaust.grant.programAcademic Excellence Alliance (AEA)en
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