Gold Wire-networks: Particle Array Guided Evaporation Lithograpy

Handle URI:
http://hdl.handle.net/10754/595126
Title:
Gold Wire-networks: Particle Array Guided Evaporation Lithograpy
Authors:
Lone, Saifullah ( 0000-0003-1026-7748 ) ; Zhang, Jiaming ( 0000-0003-3208-8118 ) ; Vakarelski, Ivan Uriev ( 0000-0001-9244-9160 ) ; Thoroddsen, Sigurdur T. ( 0000-0001-6997-4311 )
Abstract:
We exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.
KAUST Department:
High-Speed Fluids Imaging Laboratory; Physical Sciences and Engineering (PSE) Division
Conference/Event name:
International Conference on Advances in Functional Materials (AFM 2015)
Issue Date:
29-Jun-2015
Type:
Presentation
Additional Links:
http://afm2015.functionalmaterials.org/wp-content/uploads/2015/07/S2-Abs.pdf
Appears in Collections:
Physical Sciences and Engineering (PSE) Division; Presentations

Full metadata record

DC FieldValue Language
dc.contributor.authorLone, Saifullahen
dc.contributor.authorZhang, Jiamingen
dc.contributor.authorVakarelski, Ivan Urieven
dc.contributor.authorThoroddsen, Sigurdur T.en
dc.date.accessioned2016-01-28T07:14:02Zen
dc.date.available2016-01-28T07:14:02Zen
dc.date.issued2015-06-29en
dc.identifier.urihttp://hdl.handle.net/10754/595126en
dc.description.abstractWe exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.en
dc.relation.urlhttp://afm2015.functionalmaterials.org/wp-content/uploads/2015/07/S2-Abs.pdfen
dc.subjectDry Depositionen
dc.subjectLift-upen
dc.subjectDopingen
dc.subjectEvaporationen
dc.subjectSelf-Assemblyen
dc.subjectWiresen
dc.titleGold Wire-networks: Particle Array Guided Evaporation Lithograpyen
dc.typePresentationen
dc.contributor.departmentHigh-Speed Fluids Imaging Laboratoryen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.conference.date29 June – 3 July 2015en
dc.conference.nameInternational Conference on Advances in Functional Materials (AFM 2015)en
dc.conference.locationStony Brook University, NY State, USAen
kaust.authorLone, Saifullahen
kaust.authorZhang, Jiamingen
kaust.authorVakarelski, Ivan Urieven
kaust.authorThoroddsen, Sigurdur T.en
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