High Q, Miniaturized LCP-Based Passive Components

Handle URI:
http://hdl.handle.net/10754/595068
Title:
High Q, Miniaturized LCP-Based Passive Components
Authors:
Shamim, Atif ( 0000-0002-4207-4740 ) ; Arabi, Eyad A. ( 0000-0003-2855-2061 )
Assignee:
King Abdullah University of Science and Technology
Abstract:
Various methods and systems are provided for high Q, miniaturized LCP-based passive components. In one embodiment, among others, a spiral inductor includes a center connection and a plurality of inductors formed on a liquid crystal polymer (LCP) layer, the plurality of inductors concentrically spiraling out from the center connection. In another embodiment, a vertically intertwined inductor includes first and second inductors including a first section disposed on a side of the LCP layer forming a fraction of a turn and a second section disposed on another side of the LCP layer. At least a portion of the first section of the first inductor is substantially aligned with at least a portion of the second section of the second inductor and at least a portion of the first section of the second inductor is substantially aligned with at least a portion of the second section of the first inductor.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Issue Date:
16-Oct-2014
Submitted date:
2014-04-14
Type:
Patent
Application Number:
US 20140306793 A1
Patent Status:
Published Application
Additional Links:
http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220140306793%22.PGNR.&OS=DN/20140306793&RS=DN/20140306793; http://assignment.uspto.gov/#/search?adv=publNum:20140306793; http://www.google.com/patents/US20140306793; http://worldwide.espacenet.com/publicationDetails/biblio?CC=US&NR=2014306793A1&KC=A1&FT=D
Appears in Collections:
Patents; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorShamim, Atifen
dc.contributor.authorArabi, Eyad A.en
dc.date.accessioned2016-01-28T06:13:39Zen
dc.date.available2016-01-28T06:13:39Zen
dc.date.issued2014-10-16en
dc.date.submitted2014-04-14en
dc.identifier.urihttp://hdl.handle.net/10754/595068en
dc.description.abstractVarious methods and systems are provided for high Q, miniaturized LCP-based passive components. In one embodiment, among others, a spiral inductor includes a center connection and a plurality of inductors formed on a liquid crystal polymer (LCP) layer, the plurality of inductors concentrically spiraling out from the center connection. In another embodiment, a vertically intertwined inductor includes first and second inductors including a first section disposed on a side of the LCP layer forming a fraction of a turn and a second section disposed on another side of the LCP layer. At least a portion of the first section of the first inductor is substantially aligned with at least a portion of the second section of the second inductor and at least a portion of the first section of the second inductor is substantially aligned with at least a portion of the second section of the first inductor.en
dc.relation.urlhttp://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220140306793%22.PGNR.&OS=DN/20140306793&RS=DN/20140306793en
dc.relation.urlhttp://assignment.uspto.gov/#/search?adv=publNum:20140306793en
dc.relation.urlhttp://www.google.com/patents/US20140306793en
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=US&NR=2014306793A1&KC=A1&FT=Den
dc.titleHigh Q, Miniaturized LCP-Based Passive Componentsen
dc.typePatenten
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.description.statusPublished Applicationen
dc.contributor.assigneeKing Abdullah University of Science and Technologyen
dc.description.countryUnited Statesen
dc.identifier.applicationnumberUS 20140306793 A1en
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