Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Handle URI:
http://hdl.handle.net/10754/592510
Title:
Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels
Authors:
Ghoneim, Mohamed T. ( 0000-0002-5568-5284 ) ; Fahad, Hossain M.; Hussain, Aftab M. ( 0000-0002-9516-9428 ) ; Rojas, Jhonathan Prieto ( 0000-0001-7848-1121 ) ; Sevilla, Galo T. ( 0000-0002-9419-4437 ) ; Alfaraj, Nasir ( 0000-0002-0429-9439 ) ; Lizardo, Ernesto B.; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
KAUST Department:
Integrated Nanotechnology Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Citation:
Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels 2015, 5 (12):127115 AIP Advances
Publisher:
AIP Publishing
Journal:
AIP Advances
Issue Date:
11-Dec-2015
DOI:
10.1063/1.4938101
Type:
Article
ISSN:
2158-3226
Additional Links:
http://scitation.aip.org/content/aip/journal/adva/5/12/10.1063/1.4938101
Appears in Collections:
Articles; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorGhoneim, Mohamed T.en
dc.contributor.authorFahad, Hossain M.en
dc.contributor.authorHussain, Aftab M.en
dc.contributor.authorRojas, Jhonathan Prietoen
dc.contributor.authorSevilla, Galo T.en
dc.contributor.authorAlfaraj, Nasiren
dc.contributor.authorLizardo, Ernesto B.en
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2015-12-22T14:49:47Zen
dc.date.available2015-12-22T14:49:47Zen
dc.date.issued2015-12-11en
dc.identifier.citationEnhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels 2015, 5 (12):127115 AIP Advancesen
dc.identifier.issn2158-3226en
dc.identifier.doi10.1063/1.4938101en
dc.identifier.urihttp://hdl.handle.net/10754/592510en
dc.description.abstractIn today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.en
dc.language.isoenen
dc.publisherAIP Publishingen
dc.relation.urlhttp://scitation.aip.org/content/aip/journal/adva/5/12/10.1063/1.4938101en
dc.rightsArchived with thanks to AIP Advancesen
dc.titleEnhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channelsen
dc.typeArticleen
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journalAIP Advancesen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)en
kaust.authorGhoneim, Mohamed T.en
kaust.authorFahad, Hossain M.en
kaust.authorHussain, Aftab M.en
kaust.authorRojas, Jhonathan Prietoen
kaust.authorSevilla, Galo T.en
kaust.authorAlfaraj, Nasiren
kaust.authorLizardo, Ernesto B.en
kaust.authorHussain, Muhammad Mustafaen
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