Improving adhesion of copper/epoxy joints by pulsed laser ablation

Handle URI:
http://hdl.handle.net/10754/581763
Title:
Improving adhesion of copper/epoxy joints by pulsed laser ablation
Authors:
Hernandez, Edwin; Alfano, Marco; Lubineau, Gilles ( 0000-0002-7370-6093 ) ; Buttner, Ulrich
Abstract:
The purpose of the present work is to analyze the effect of pulsed laser ablation on copper substrates (CuZn40) deployed for adhesive bonding. Surface pre-treatment was carried using an Yb-fiber laser beam. Treated surfaces were probed using Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS). The mechanical performance of CuZn40/epoxy bonded joints was assessed using the T-peel test coupon. In order to resolve the mechanisms of failure and adhesive penetration within surface asperities induced by the laser treatment, fracture surfaces were surveyed using SEM. Finite element simulations, based on the use of the cohesive zone model of fracture, were carried out to evaluate the variation of bond toughness. Results indicated that the laser ablation process effectively modifies surface morphology and chemistry and enables enhanced mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy and bond toughness were observed with respect to control samples with sanded substrates.
KAUST Department:
Physical Sciences and Engineering (PSE) Division; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Citation:
Improving adhesion of copper/epoxy joints by pulsed laser ablation 2016, 64:23 International Journal of Adhesion and Adhesives
Publisher:
Elsevier BV
Journal:
International Journal of Adhesion and Adhesives
Issue Date:
19-Oct-2015
DOI:
10.1016/j.ijadhadh.2015.10.003
Type:
Article
ISSN:
01437496
Additional Links:
http://linkinghub.elsevier.com/retrieve/pii/S0143749615001566
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorHernandez, Edwinen
dc.contributor.authorAlfano, Marcoen
dc.contributor.authorLubineau, Gillesen
dc.contributor.authorButtner, Ulrichen
dc.date.accessioned2015-11-05T05:43:10Zen
dc.date.available2015-11-05T05:43:10Zen
dc.date.issued2015-10-19en
dc.identifier.citationImproving adhesion of copper/epoxy joints by pulsed laser ablation 2016, 64:23 International Journal of Adhesion and Adhesivesen
dc.identifier.issn01437496en
dc.identifier.doi10.1016/j.ijadhadh.2015.10.003en
dc.identifier.urihttp://hdl.handle.net/10754/581763en
dc.description.abstractThe purpose of the present work is to analyze the effect of pulsed laser ablation on copper substrates (CuZn40) deployed for adhesive bonding. Surface pre-treatment was carried using an Yb-fiber laser beam. Treated surfaces were probed using Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS). The mechanical performance of CuZn40/epoxy bonded joints was assessed using the T-peel test coupon. In order to resolve the mechanisms of failure and adhesive penetration within surface asperities induced by the laser treatment, fracture surfaces were surveyed using SEM. Finite element simulations, based on the use of the cohesive zone model of fracture, were carried out to evaluate the variation of bond toughness. Results indicated that the laser ablation process effectively modifies surface morphology and chemistry and enables enhanced mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy and bond toughness were observed with respect to control samples with sanded substrates.en
dc.language.isoenen
dc.publisherElsevier BVen
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S0143749615001566en
dc.rightsNOTICE: this is the author’s version of a work that was accepted for publication in International Journal of Adhesion and Adhesives. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in International Journal of Adhesion and Adhesives, 19 October 2015. DOI: 10.1016/j.ijadhadh.2015.10.003en
dc.subjectLaser ablationen
dc.subjectCopper alloyen
dc.subjectEpoxyen
dc.subjectInterlockingen
dc.titleImproving adhesion of copper/epoxy joints by pulsed laser ablationen
dc.typeArticleen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalInternational Journal of Adhesion and Adhesivesen
dc.eprint.versionPost-printen
dc.contributor.institutionDepartment of Mechanical, Energy and Management Engineering, University of Calabria, Via P. Bucci 44C, 87036 Rende (CS), Italyen
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)en
kaust.authorHernandez, Edwinen
kaust.authorLubineau, Gillesen
kaust.authorButtner, Ulrichen
All Items in KAUST are protected by copyright, with all rights reserved, unless otherwise indicated.