Platform Isolation Using Out-of-Plane Complaint Mechanisms

Handle URI:
http://hdl.handle.net/10754/581359
Title:
Platform Isolation Using Out-of-Plane Complaint Mechanisms
Authors:
Arevalo, A.; Rawashdeh, E.; Foulds, I. G.
Abstract:
This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Journal:
Proceedings of the 2014 COMSOL Conference in Boston
Conference/Event name:
the 2014 COMSOL Conference
Issue Date:
8-Oct-2014
Type:
Conference Paper; Presentation; Poster
Additional Links:
https://www.comsol.com/paper/platform-isolation-using-out-of-plane-complaint-mechanisms-19569
Appears in Collections:
Conference Papers; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorArevalo, A.en
dc.contributor.authorRawashdeh, E.en
dc.contributor.authorFoulds, I. G.en
dc.date.accessioned2015-10-28T13:35:32Zen
dc.date.available2015-10-28T13:35:32Zen
dc.date.issued2014-10-08en
dc.identifier.urihttp://hdl.handle.net/10754/581359en
dc.description.abstractThis paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.en
dc.relation.urlhttps://www.comsol.com/paper/platform-isolation-using-out-of-plane-complaint-mechanisms-19569en
dc.titlePlatform Isolation Using Out-of-Plane Complaint Mechanismsen
dc.typeConference Paperen
dc.typePresentationen
dc.typePosteren
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journalProceedings of the 2014 COMSOL Conference in Bostonen
dc.conference.dateOctober 8-10, 2014en
dc.conference.namethe 2014 COMSOL Conferenceen
dc.conference.locationBoston, MA, USAen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionSchool of Engineering, University of British Columbia - Okanagan, Vancouver, BC, Canadaen
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