Gain enhancement of low profile on-chip dipole antenna via Artificial Magnetic Conductor at 94 GHz

Handle URI:
http://hdl.handle.net/10754/576153
Title:
Gain enhancement of low profile on-chip dipole antenna via Artificial Magnetic Conductor at 94 GHz
Authors:
Nafe, Mahmoud ( 0000-0002-4335-7187 ) ; Syed, Ahad; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
The bottleneck for realizing high efficiency System-on-Chip is integrating the antenna on the lossy silicon substrate. To shield the antenna from the silicon, a ground plane can be used. However, the ultra-thin oxide does not provide enough separation between the antenna and the ground plane. In this work, we demonstrate one of the highest reported gains to date for low profile 94 GHz on-chip dipole antenna while the ground plane is in the lowest metal in the oxide (M1). This is achieved by optimizing an Artificial Magnetic Conductor (AMC) structure midway the antenna and M1. The dipole antenna without the AMC has a gain of − 11 dBi while with the AMC structure a gain of + 4.8 dBi and hence achieving a gain enhancement of + 15.8 dB.
KAUST Department:
Electrical Engineering Program
Publisher:
IEEE
Journal:
Antennas and Propagation (EuCAP), 2015 9th European Conference on
Conference/Event name:
2015 9th European Conference on Antennas and Propagation (EuCAP)
Issue Date:
13-Apr-2015
Type:
Conference Paper
Additional Links:
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7228539&contentType=Conference+Publications
Appears in Collections:
Conference Papers; Electrical Engineering Program

Full metadata record

DC FieldValue Language
dc.contributor.authorNafe, Mahmouden
dc.contributor.authorSyed, Ahaden
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-09-01T11:47:56Zen
dc.date.available2015-09-01T11:47:56Zen
dc.date.issued2015-04-13en
dc.identifier.urihttp://hdl.handle.net/10754/576153en
dc.description.abstractThe bottleneck for realizing high efficiency System-on-Chip is integrating the antenna on the lossy silicon substrate. To shield the antenna from the silicon, a ground plane can be used. However, the ultra-thin oxide does not provide enough separation between the antenna and the ground plane. In this work, we demonstrate one of the highest reported gains to date for low profile 94 GHz on-chip dipole antenna while the ground plane is in the lowest metal in the oxide (M1). This is achieved by optimizing an Artificial Magnetic Conductor (AMC) structure midway the antenna and M1. The dipole antenna without the AMC has a gain of − 11 dBi while with the AMC structure a gain of + 4.8 dBi and hence achieving a gain enhancement of + 15.8 dB.en
dc.publisherIEEEen
dc.relation.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7228539&contentType=Conference+Publicationsen
dc.subjectmm-waveen
dc.subjecton-chip antennaen
dc.subjectSoCen
dc.subjectartifical magnetic conductor (AMC) and High-Impedance-Surface (HiS)en
dc.titleGain enhancement of low profile on-chip dipole antenna via Artificial Magnetic Conductor at 94 GHzen
dc.typeConference Paperen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalAntennas and Propagation (EuCAP), 2015 9th European Conference onen
dc.conference.date13-17 April 2015en
dc.conference.name2015 9th European Conference on Antennas and Propagation (EuCAP)en
dc.conference.locationLisbon, Portugalen
dc.eprint.versionPublisher's Version/PDFen
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