A simple and cost-effective method for fabrication of integrated electronic-microfluidic devices using a laser-patterned PDMS layer

Handle URI:
http://hdl.handle.net/10754/575555
Title:
A simple and cost-effective method for fabrication of integrated electronic-microfluidic devices using a laser-patterned PDMS layer
Authors:
Li, Ming; Li, Shunbo; Wu, Jinbo; Wen, Weijia; Li, Weihua; Alici, Gürsel
Abstract:
We report a simple and cost-effective method for fabricating integrated electronic-microfluidic devices with multilayer configurations. A CO 2 laser plotter was employed to directly write patterns on a transferred polydimethylsiloxane (PDMS) layer, which served as both a bonding and a working layer. The integration of electronics in microfluidic devices was achieved by an alignment bonding of top and bottom electrode-patterned substrates fabricated with conventional lithography, sputtering and lift-off techniques. Processes of the developed fabrication method were illustrated. Major issues associated with this method as PDMS surface treatment and characterization, thickness-control of the transferred PDMS layer, and laser parameters optimization were discussed, along with the examination and testing of bonding with two representative materials (glass and silicon). The capability of this method was further demonstrated by fabricating a microfluidic chip with sputter-coated electrodes on the top and bottom substrates. The device functioning as a microparticle focusing and trapping chip was experimentally verified. It is confirmed that the proposed method has many advantages, including simple and fast fabrication process, low cost, easy integration of electronics, strong bonding strength, chemical and biological compatibility, etc. © Springer-Verlag 2011.
KAUST Department:
KAUST-HKUST Micro/Nanofluidic Joint Laboratory; Environmental Science and Engineering Program
Publisher:
Springer Nature
Journal:
Microfluidics and Nanofluidics
Issue Date:
3-Dec-2011
DOI:
10.1007/s10404-011-0917-z
Type:
Article
ISSN:
16134982
Sponsors:
The author (W.H. Li) wishes to thank Australian government to offer an Australian Endeavour Research Fellowship (1994_2011) to enhance research collaboration with Prof. W. Wen. This project is also partially supported by University of Wollongong through a UIC grant.
Appears in Collections:
Articles; Environmental Science and Engineering Program

Full metadata record

DC FieldValue Language
dc.contributor.authorLi, Mingen
dc.contributor.authorLi, Shunboen
dc.contributor.authorWu, Jinboen
dc.contributor.authorWen, Weijiaen
dc.contributor.authorLi, Weihuaen
dc.contributor.authorAlici, Gürselen
dc.date.accessioned2015-08-24T08:32:44Zen
dc.date.available2015-08-24T08:32:44Zen
dc.date.issued2011-12-03en
dc.identifier.issn16134982en
dc.identifier.doi10.1007/s10404-011-0917-zen
dc.identifier.urihttp://hdl.handle.net/10754/575555en
dc.description.abstractWe report a simple and cost-effective method for fabricating integrated electronic-microfluidic devices with multilayer configurations. A CO 2 laser plotter was employed to directly write patterns on a transferred polydimethylsiloxane (PDMS) layer, which served as both a bonding and a working layer. The integration of electronics in microfluidic devices was achieved by an alignment bonding of top and bottom electrode-patterned substrates fabricated with conventional lithography, sputtering and lift-off techniques. Processes of the developed fabrication method were illustrated. Major issues associated with this method as PDMS surface treatment and characterization, thickness-control of the transferred PDMS layer, and laser parameters optimization were discussed, along with the examination and testing of bonding with two representative materials (glass and silicon). The capability of this method was further demonstrated by fabricating a microfluidic chip with sputter-coated electrodes on the top and bottom substrates. The device functioning as a microparticle focusing and trapping chip was experimentally verified. It is confirmed that the proposed method has many advantages, including simple and fast fabrication process, low cost, easy integration of electronics, strong bonding strength, chemical and biological compatibility, etc. © Springer-Verlag 2011.en
dc.description.sponsorshipThe author (W.H. Li) wishes to thank Australian government to offer an Australian Endeavour Research Fellowship (1994_2011) to enhance research collaboration with Prof. W. Wen. This project is also partially supported by University of Wollongong through a UIC grant.en
dc.publisherSpringer Natureen
dc.subjectDielectrophoresisen
dc.subjectElectronics integrationen
dc.subjectLaser ablationen
dc.subjectMicrofluidicsen
dc.subjectPDMSen
dc.subjectTransfer bondingen
dc.titleA simple and cost-effective method for fabrication of integrated electronic-microfluidic devices using a laser-patterned PDMS layeren
dc.typeArticleen
dc.contributor.departmentKAUST-HKUST Micro/Nanofluidic Joint Laboratoryen
dc.contributor.departmentEnvironmental Science and Engineering Programen
dc.identifier.journalMicrofluidics and Nanofluidicsen
dc.contributor.institutionSchool of Mechanical, Materials and Mechatronic Engineering, University of Wollongong, Wollongong 2522, NSW, Australiaen
dc.contributor.institutionDepartment of Physics, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kongen
kaust.authorWu, Jinboen
kaust.authorWen, Weijiaen
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