Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

Handle URI:
http://hdl.handle.net/10754/564872
Title:
Solid state MEMS devices on flexible and semi-transparent silicon (100) platform
Authors:
Ahmed, Sally; Hussain, Aftab M. ( 0000-0002-9516-9428 ) ; Rojas, Jhonathan Prieto ( 0000-0001-7848-1121 ) ; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.
KAUST Department:
Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
Conference/Event name:
27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Issue Date:
Jan-2014
DOI:
10.1109/MEMSYS.2014.6765699
Type:
Conference Paper
ISSN:
10846999
ISBN:
9781479935086
Appears in Collections:
Conference Papers; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorAhmed, Sallyen
dc.contributor.authorHussain, Aftab M.en
dc.contributor.authorRojas, Jhonathan Prietoen
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2015-08-04T07:23:43Zen
dc.date.available2015-08-04T07:23:43Zen
dc.date.issued2014-01en
dc.identifier.isbn9781479935086en
dc.identifier.issn10846999en
dc.identifier.doi10.1109/MEMSYS.2014.6765699en
dc.identifier.urihttp://hdl.handle.net/10754/564872en
dc.description.abstractWe report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectFlexible electronicsen
dc.subjectSacrificial layeren
dc.subjectStructural layeren
dc.subjectThermal flexure actuatoren
dc.titleSolid state MEMS devices on flexible and semi-transparent silicon (100) platformen
dc.typeConference Paperen
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journal2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)en
dc.conference.date26 January 2014 through 30 January 2014en
dc.conference.name27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014en
dc.conference.locationSan Francisco, CAen
kaust.authorAhmed, Sallyen
kaust.authorHussain, Aftab M.en
kaust.authorRojas, Jhonathan Prietoen
kaust.authorHussain, Muhammad Mustafaen
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