SIW based multilayer transition and power divider in LTCC technology

Handle URI:
http://hdl.handle.net/10754/564754
Title:
SIW based multilayer transition and power divider in LTCC technology
Authors:
Abuzaid, Hattan; Doghri, Ali; Wu, Ke; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.
KAUST Department:
Electrical Engineering Program; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
Conference/Event name:
2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
Issue Date:
Jun-2013
DOI:
10.1109/MWSYM.2013.6697791
Type:
Conference Paper
ISSN:
0149645X
ISBN:
9781467361767
Appears in Collections:
Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorAbuzaid, Hattanen
dc.contributor.authorDoghri, Alien
dc.contributor.authorWu, Keen
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-08-04T07:14:50Zen
dc.date.available2015-08-04T07:14:50Zen
dc.date.issued2013-06en
dc.identifier.isbn9781467361767en
dc.identifier.issn0149645Xen
dc.identifier.doi10.1109/MWSYM.2013.6697791en
dc.identifier.urihttp://hdl.handle.net/10754/564754en
dc.description.abstractA multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectLow temperature co-fired ceramic (LTCC)en
dc.subjectMultilayer transitionen
dc.subjectPower divideren
dc.subjectSubstrate integrated waveguide (SIW)en
dc.titleSIW based multilayer transition and power divider in LTCC technologyen
dc.typeConference Paperen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journal2013 IEEE MTT-S International Microwave Symposium Digest (MTT)en
dc.conference.date2 June 2013 through 7 June 2013en
dc.conference.name2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013en
dc.conference.locationSeattle, WAen
dc.contributor.institutionPoly-Grames Research Center, Département of génie électrique, Ecole Polytechnique de Montreal, C.P. 6079, Succ. Centre-ville, Montréal, QC, Canadaen
kaust.authorAbuzaid, Hattanen
kaust.authorShamim, Atifen
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