Surface tension-induced high aspect-ratio PDMS micropillars with concave and convex lens tips

Handle URI:
http://hdl.handle.net/10754/564703
Title:
Surface tension-induced high aspect-ratio PDMS micropillars with concave and convex lens tips
Authors:
Li, Huawei; Fan, Yiqiang; Yi, Ying; Foulds, Ian G.
Abstract:
This paper reports a novel method for the fabrication of 3-dimensional (3D) Polydimethylsiloxane (PDMS) micropillars with concave and convex lens tips in a one-step molding process, using a CO2 laser-machined Poly(methyl methacrylate) (PMMA) mold with through holes. The PDMS micropillars are 4 mm high and have an aspect ratio of 251. The micropillars are formed by capillary force drawing up PDMS into the through hole mold. The concave and convex lens tips of the PDMS cylindrical micropillars are induced by surface tension and are controllable by changing the surface wetting properties of the through holes in the PMMA mold. This technique eliminates the requirements of expensive and complicated facilities to prepare a 3D mold, and it provides a simple and rapid method to fabricate 3D PDMS micropillars with controllable dimensions and tip shapes. © 2013 IEEE.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe); Electrical Engineering Program
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Conference/Event name:
8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Issue Date:
Apr-2013
DOI:
10.1109/NEMS.2013.6559711
Type:
Conference Paper
ISBN:
9781467363525
Appears in Collections:
Conference Papers; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorLi, Huaweien
dc.contributor.authorFan, Yiqiangen
dc.contributor.authorYi, Yingen
dc.contributor.authorFoulds, Ian G.en
dc.date.accessioned2015-08-04T07:13:04Zen
dc.date.available2015-08-04T07:13:04Zen
dc.date.issued2013-04en
dc.identifier.isbn9781467363525en
dc.identifier.doi10.1109/NEMS.2013.6559711en
dc.identifier.urihttp://hdl.handle.net/10754/564703en
dc.description.abstractThis paper reports a novel method for the fabrication of 3-dimensional (3D) Polydimethylsiloxane (PDMS) micropillars with concave and convex lens tips in a one-step molding process, using a CO2 laser-machined Poly(methyl methacrylate) (PMMA) mold with through holes. The PDMS micropillars are 4 mm high and have an aspect ratio of 251. The micropillars are formed by capillary force drawing up PDMS into the through hole mold. The concave and convex lens tips of the PDMS cylindrical micropillars are induced by surface tension and are controllable by changing the surface wetting properties of the through holes in the PMMA mold. This technique eliminates the requirements of expensive and complicated facilities to prepare a 3D mold, and it provides a simple and rapid method to fabricate 3D PDMS micropillars with controllable dimensions and tip shapes. © 2013 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectconcave and convexlensen
dc.subjectmicropillarsen
dc.subjectPDMSen
dc.subjectsurface tensionen
dc.titleSurface tension-induced high aspect-ratio PDMS micropillars with concave and convex lens tipsen
dc.typeConference Paperen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)en
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalThe 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systemsen
dc.conference.date7 April 2013 through 10 April 2013en
dc.conference.name8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013en
dc.conference.locationSuzhouen
kaust.authorLi, Huaweien
kaust.authorFan, Yiqiangen
kaust.authorYi, Yingen
kaust.authorFoulds, Ian G.en
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