Mechanically flexible optically transparent porous mono-crystalline silicon substrate

Handle URI:
http://hdl.handle.net/10754/564516
Title:
Mechanically flexible optically transparent porous mono-crystalline silicon substrate
Authors:
Rojas, Jhonathan Prieto ( 0000-0001-7848-1121 ) ; Syed, Ahad A.; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates. © 2012 IEEE.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Integrated Nanotechnology Lab
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)
Conference/Event name:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Issue Date:
Jan-2012
DOI:
10.1109/MEMSYS.2012.6170146
Type:
Conference Paper
ISSN:
10846999
ISBN:
9781467303248
Appears in Collections:
Conference Papers; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorRojas, Jhonathan Prietoen
dc.contributor.authorSyed, Ahad A.en
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2015-08-04T07:02:58Zen
dc.date.available2015-08-04T07:02:58Zen
dc.date.issued2012-01en
dc.identifier.isbn9781467303248en
dc.identifier.issn10846999en
dc.identifier.doi10.1109/MEMSYS.2012.6170146en
dc.identifier.urihttp://hdl.handle.net/10754/564516en
dc.description.abstractFor the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates. © 2012 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.titleMechanically flexible optically transparent porous mono-crystalline silicon substrateen
dc.typeConference Paperen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.identifier.journal2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)en
dc.conference.date29 January 2012 through 2 February 2012en
dc.conference.name2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012en
dc.conference.locationParisen
kaust.authorRojas, Jhonathan Prietoen
kaust.authorHussain, Muhammad Mustafaen
kaust.authorSyed, Ahad A.en
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