Effects of wafer-level packaging on millimetre-wave antennas

Handle URI:
http://hdl.handle.net/10754/564448
Title:
Effects of wafer-level packaging on millimetre-wave antennas
Authors:
Abutarboush, Hattan; Tawfik, Hani H.; Soliman, Ezzeldin A.; Sallam, Mai O.; Shamim, Atif ( 0000-0002-4207-4740 ) ; Sedky, Sherif M.
Abstract:
A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Physical Sciences and Engineering (PSE) Division; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
2011 Loughborough Antennas & Propagation Conference
Conference/Event name:
7th Loughborough Antennas and Propagation Conference, LAPC 2011
Issue Date:
Nov-2011
DOI:
10.1109/LAPC.2011.6113964
Type:
Conference Paper
ISBN:
9781457710155
Appears in Collections:
Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorAbutarboush, Hattanen
dc.contributor.authorTawfik, Hani H.en
dc.contributor.authorSoliman, Ezzeldin A.en
dc.contributor.authorSallam, Mai O.en
dc.contributor.authorShamim, Atifen
dc.contributor.authorSedky, Sherif M.en
dc.date.accessioned2015-08-04T07:01:15Zen
dc.date.available2015-08-04T07:01:15Zen
dc.date.issued2011-11en
dc.identifier.isbn9781457710155en
dc.identifier.doi10.1109/LAPC.2011.6113964en
dc.identifier.urihttp://hdl.handle.net/10754/564448en
dc.description.abstractA cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectmm-Wave Antennaen
dc.subjectPackagingen
dc.subjectSmall Antennaen
dc.subjectWafer-Level Packagingen
dc.titleEffects of wafer-level packaging on millimetre-wave antennasen
dc.typeConference Paperen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journal2011 Loughborough Antennas & Propagation Conferenceen
dc.conference.date14 November 2011 through 15 November 2011en
dc.conference.name7th Loughborough Antennas and Propagation Conference, LAPC 2011en
dc.conference.locationLoughboroughen
dc.contributor.institutionSchool of Science and Engineering, American University in Cairo (AUC), New Cairo, Egypten
kaust.authorAbutarboush, Hattanen
kaust.authorShamim, Atifen
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