Development of a passive and remote magnetic microsensor with thin-film giant magnetoimpedance element and surface acoustic wave transponder

Handle URI:
http://hdl.handle.net/10754/564327
Title:
Development of a passive and remote magnetic microsensor with thin-film giant magnetoimpedance element and surface acoustic wave transponder
Authors:
Al Rowais, Hommood; Li, Bodong ( 0000-0002-4024-4400 ) ; Liang, Cai ( 0000-0002-5844-3432 ) ; Green, Scott Ryan; Gianchandani, Yogesh B.; Kosel, Jürgen ( 0000-0002-8998-8275 )
Abstract:
This paper presents the development of a wireless magnetic field sensor consisting of a three-layer thin-film giant magnetoimpedance sensor and a surface acoustic wave device on one substrate. The goal of this integration is a passive and remotely interrogated sensor that can be easily mass fabricated using standard microfabrication tools. The design parameters, fabrication process, and a model of the integrated sensor are presented together with experimental results of the sensor. © 2011 American Institute of Physics.
KAUST Department:
Physical Sciences and Engineering (PSE) Division; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Sensing, Magnetism and Microsystems Lab
Publisher:
AIP Publishing
Journal:
Journal of Applied Physics
Issue Date:
2011
DOI:
10.1063/1.3562041
Type:
Article
ISSN:
00218979
Sponsors:
This work was performed in part at the Lurie Nanofabrication Facility at the University of Michigan, a member of the National Nanotechnology Infrastructure Network, which is supported in part by the National Science Foundation.
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Sensing, Magnetism and Microsystems Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorAl Rowais, Hommooden
dc.contributor.authorLi, Bodongen
dc.contributor.authorLiang, Caien
dc.contributor.authorGreen, Scott Ryanen
dc.contributor.authorGianchandani, Yogesh B.en
dc.contributor.authorKosel, Jürgenen
dc.date.accessioned2015-08-04T06:23:49Zen
dc.date.available2015-08-04T06:23:49Zen
dc.date.issued2011en
dc.identifier.issn00218979en
dc.identifier.doi10.1063/1.3562041en
dc.identifier.urihttp://hdl.handle.net/10754/564327en
dc.description.abstractThis paper presents the development of a wireless magnetic field sensor consisting of a three-layer thin-film giant magnetoimpedance sensor and a surface acoustic wave device on one substrate. The goal of this integration is a passive and remotely interrogated sensor that can be easily mass fabricated using standard microfabrication tools. The design parameters, fabrication process, and a model of the integrated sensor are presented together with experimental results of the sensor. © 2011 American Institute of Physics.en
dc.description.sponsorshipThis work was performed in part at the Lurie Nanofabrication Facility at the University of Michigan, a member of the National Nanotechnology Infrastructure Network, which is supported in part by the National Science Foundation.en
dc.publisherAIP Publishingen
dc.titleDevelopment of a passive and remote magnetic microsensor with thin-film giant magnetoimpedance element and surface acoustic wave transponderen
dc.typeArticleen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentSensing, Magnetism and Microsystems Laben
dc.identifier.journalJournal of Applied Physicsen
dc.contributor.institutionDepartment of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109, United Statesen
kaust.authorLi, Bodongen
kaust.authorLiang, Caien
kaust.authorKosel, Jürgenen
kaust.authorAl Rowais, Hommooden
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