Post annealing performance evaluation of printable interdigital capacitive sensors by principal component analysis

Handle URI:
http://hdl.handle.net/10754/564179
Title:
Post annealing performance evaluation of printable interdigital capacitive sensors by principal component analysis
Authors:
Zia, Asif Iqbal; Mukhopadhyay, Subhas Chandra; Yu, Paklam; Al-Bahadly, Ibrahim H.; Gooneratne, Chinthaka Pasan; Kosel, Jürgen ( 0000-0002-8998-8275 )
Abstract:
The surface roughness of thin-film gold electrodes induces instability in impedance spectroscopy measurements of capacitive interdigital printable sensors. Post-fabrication thermodynamic annealing was carried out at temperatures ranging from 30 °C to 210 °C in a vacuum oven and the variation in surface morphology of thin-film gold electrodes was observed by scanning electron microscopy. Impedance spectra obtained at different temperatures were translated into equivalent circuit models by applying complex nonlinear least square curve-fitting algorithm. Principal component analysis was applied to deduce the classification of the parameters affected due to the annealing process and to evaluate the performance stability using mathematical model. Physics of the thermodynamic annealing was discussed based on the surface activation energies. The post anneal testing of the sensors validated the achieved stability in impedance measurement. © 2001-2012 IEEE.
KAUST Department:
Sensing, Magnetism and Microsystems Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
IEEE Sensors Journal
Issue Date:
Jun-2015
DOI:
10.1109/JSEN.2014.2355224
Type:
Article
ISSN:
1530437X
Sponsors:
This work was supported in part by the Higher Education Commission, Lahore, Pakistan, in part by the School of Engineering and Advanced Technology, Massey University, Palmerston North, New Zealand, and in part by the COMSATS University of Science and Technology, Islamabad, Pakistan. The associate editor coordinating the review of this paper and approving it for publication was Dr. Ravinder S. Dahiya.
Appears in Collections:
Articles; Electrical Engineering Program; Sensing, Magnetism and Microsystems Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorZia, Asif Iqbalen
dc.contributor.authorMukhopadhyay, Subhas Chandraen
dc.contributor.authorYu, Paklamen
dc.contributor.authorAl-Bahadly, Ibrahim H.en
dc.contributor.authorGooneratne, Chinthaka Pasanen
dc.contributor.authorKosel, Jürgenen
dc.date.accessioned2015-08-03T12:35:20Zen
dc.date.available2015-08-03T12:35:20Zen
dc.date.issued2015-06en
dc.identifier.issn1530437Xen
dc.identifier.doi10.1109/JSEN.2014.2355224en
dc.identifier.urihttp://hdl.handle.net/10754/564179en
dc.description.abstractThe surface roughness of thin-film gold electrodes induces instability in impedance spectroscopy measurements of capacitive interdigital printable sensors. Post-fabrication thermodynamic annealing was carried out at temperatures ranging from 30 °C to 210 °C in a vacuum oven and the variation in surface morphology of thin-film gold electrodes was observed by scanning electron microscopy. Impedance spectra obtained at different temperatures were translated into equivalent circuit models by applying complex nonlinear least square curve-fitting algorithm. Principal component analysis was applied to deduce the classification of the parameters affected due to the annealing process and to evaluate the performance stability using mathematical model. Physics of the thermodynamic annealing was discussed based on the surface activation energies. The post anneal testing of the sensors validated the achieved stability in impedance measurement. © 2001-2012 IEEE.en
dc.description.sponsorshipThis work was supported in part by the Higher Education Commission, Lahore, Pakistan, in part by the School of Engineering and Advanced Technology, Massey University, Palmerston North, New Zealand, and in part by the COMSATS University of Science and Technology, Islamabad, Pakistan. The associate editor coordinating the review of this paper and approving it for publication was Dr. Ravinder S. Dahiya.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.titlePost annealing performance evaluation of printable interdigital capacitive sensors by principal component analysisen
dc.typeArticleen
dc.contributor.departmentSensing, Magnetism and Microsystems Laben
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalIEEE Sensors Journalen
dc.contributor.institutionCOMSATS Institute of Information TechnologyIslamabad, Pakistanen
dc.contributor.institutionSchool of Engineering and Advanced Technology, Massey UniversityPalmerston North, New Zealanden
kaust.authorGooneratne, Chinthaka Pasanen
kaust.authorKosel, Jürgenen
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