Fully inkjet printed RF inductors and capacitors using polymer dielectric and silver conductive ink with through vias

Handle URI:
http://hdl.handle.net/10754/564090
Title:
Fully inkjet printed RF inductors and capacitors using polymer dielectric and silver conductive ink with through vias
Authors:
McKerricher, Garret ( 0000-0002-6920-842X ) ; Gonzalez Perez, Jose; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
In this paper, fully inkjet printed multilayer capacitors and inductors are fabricated and characterized using poly 4-vinylphenol (PVP) ink as the dielectric layer and silver nanoparticle ink as the conductor. Inkjet printed through vias, created with a novel dissolving method are used to make RF structures in a multilayer inkjet printing process. The vias have been realized in a 350-nm PVP film and exhibit resistance better than 0.1 Ω. Spiral inductors from 10 to 75 nH have been realized with maximum quality factors around five. The 10-nH inductor exhibits a self-resonant frequency slightly below 1 GHz. Metal-insulator-metal capacitors are realized with densities of 50 pF/mm-2. These capacitors demonstrate values ranging from 16 to 50 pF. The 16-pF capacitor shows a self-resonant frequency over 1.5 GHz. The successful implementation of inductors and capacitors in an all inkjet printed multilayer process with vias is an important step toward fully inkjet-printed large area and flexible RF systems.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Journal:
IEEE Transactions on Electron Devices
Issue Date:
Mar-2015
DOI:
10.1109/TED.2015.2396004
Type:
Article
ISSN:
00189383
Appears in Collections:
Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorMcKerricher, Garreten
dc.contributor.authorGonzalez Perez, Joseen
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-08-03T12:31:40Zen
dc.date.available2015-08-03T12:31:40Zen
dc.date.issued2015-03en
dc.identifier.issn00189383en
dc.identifier.doi10.1109/TED.2015.2396004en
dc.identifier.urihttp://hdl.handle.net/10754/564090en
dc.description.abstractIn this paper, fully inkjet printed multilayer capacitors and inductors are fabricated and characterized using poly 4-vinylphenol (PVP) ink as the dielectric layer and silver nanoparticle ink as the conductor. Inkjet printed through vias, created with a novel dissolving method are used to make RF structures in a multilayer inkjet printing process. The vias have been realized in a 350-nm PVP film and exhibit resistance better than 0.1 Ω. Spiral inductors from 10 to 75 nH have been realized with maximum quality factors around five. The 10-nH inductor exhibits a self-resonant frequency slightly below 1 GHz. Metal-insulator-metal capacitors are realized with densities of 50 pF/mm-2. These capacitors demonstrate values ranging from 16 to 50 pF. The 16-pF capacitor shows a self-resonant frequency over 1.5 GHz. The successful implementation of inductors and capacitors in an all inkjet printed multilayer process with vias is an important step toward fully inkjet-printed large area and flexible RF systems.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.subjectCapacitoren
dc.subjectinductoren
dc.subjectinkjet printingen
dc.subjectpassive componentsen
dc.subjectpoly 4-vinylphenol (PVP)en
dc.subjectsilver nanoparticleen
dc.subjectvia.en
dc.titleFully inkjet printed RF inductors and capacitors using polymer dielectric and silver conductive ink with through viasen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journalIEEE Transactions on Electron Devicesen
kaust.authorShamim, Atifen
kaust.authorMcKerricher, Garreten
kaust.authorGonzalez Perez, Joseen
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