Three-dimensional RF SoP technologies: LTCC versus LCP

Handle URI:
http://hdl.handle.net/10754/563924
Title:
Three-dimensional RF SoP technologies: LTCC versus LCP
Authors:
Arabi, Eyad A. ( 0000-0003-2855-2061 ) ; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
The system on package (SoP) is an emerging platform, introduced to provide enhanced functionality, and immense miniaturization through vertically integrated passive components in a multilayer process. This way the package is not a mere holder or cover but is a functional part of the system. The leading multilayer packaging technologies for SoP designs: low temperature co-fired ceramic (LTCC) and liquid crystal polymer (LCP) are compared in this work for the first time. Passive components and filters have been implemented in both technologies to show the advantages of the three-dimensional nature of these technologies. The comparison results show that parallel plate capacitors implemented in the ultra-thin LCP provides the highest capacitance density. For spiral inductors, conversely, LTCC inductors have the highest inductances while LCP inductors offer the highest self-resonant frequencies and the highest quality factors (Q). In a circuit level, simulated and measured results of a bandpass filter at 1.5 GHz show that both LCP and LTCC can provide similar performances with an incredible size reduction for the case of ultra-thin LCP. Also, the thin LCP filter exhibits a large degree of mechanical flexibility which makes this technology suitable for future flexible modules.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Publisher:
Wiley-Blackwell
Journal:
Microwave and Optical Technology Letters
Issue Date:
18-Dec-2014
DOI:
10.1002/mop.28875
Type:
Article
ISSN:
08952477
Appears in Collections:
Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorArabi, Eyad A.en
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-08-03T12:19:43Zen
dc.date.available2015-08-03T12:19:43Zen
dc.date.issued2014-12-18en
dc.identifier.issn08952477en
dc.identifier.doi10.1002/mop.28875en
dc.identifier.urihttp://hdl.handle.net/10754/563924en
dc.description.abstractThe system on package (SoP) is an emerging platform, introduced to provide enhanced functionality, and immense miniaturization through vertically integrated passive components in a multilayer process. This way the package is not a mere holder or cover but is a functional part of the system. The leading multilayer packaging technologies for SoP designs: low temperature co-fired ceramic (LTCC) and liquid crystal polymer (LCP) are compared in this work for the first time. Passive components and filters have been implemented in both technologies to show the advantages of the three-dimensional nature of these technologies. The comparison results show that parallel plate capacitors implemented in the ultra-thin LCP provides the highest capacitance density. For spiral inductors, conversely, LTCC inductors have the highest inductances while LCP inductors offer the highest self-resonant frequencies and the highest quality factors (Q). In a circuit level, simulated and measured results of a bandpass filter at 1.5 GHz show that both LCP and LTCC can provide similar performances with an incredible size reduction for the case of ultra-thin LCP. Also, the thin LCP filter exhibits a large degree of mechanical flexibility which makes this technology suitable for future flexible modules.en
dc.publisherWiley-Blackwellen
dc.subjectbandpass filtersen
dc.subjectcomparisonen
dc.subjectGPSen
dc.subjectliquid crystal polymeren
dc.subjectlow temperature co-fired ceramicen
dc.titleThree-dimensional RF SoP technologies: LTCC versus LCPen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journalMicrowave and Optical Technology Lettersen
kaust.authorArabi, Eyad A.en
kaust.authorShamim, Atifen
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