Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy

Handle URI:
http://hdl.handle.net/10754/563912
Title:
Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy
Authors:
Hussain, Aftab M. ( 0000-0002-9516-9428 ) ; Lizardo, Ernesto B.; Sevilla, Galo T. ( 0000-0002-9419-4437 ) ; Nassar, Joanna M. ( 0000-0003-4463-8877 ) ; Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 )
Abstract:
Unprecedented 800% stretchable, non-polymeric, widely used, low-cost, naturally rigid, metallic thin-film copper (Cu)-based flexible and non-invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low-cost complementary metal oxide semiconductor (CMOS) compatible integration. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Integrated Nanotechnology Lab; Electrical Engineering Program
Publisher:
Wiley
Journal:
Advanced Healthcare Materials
Issue Date:
3-Dec-2014
DOI:
10.1002/adhm.201400647; 10.1002/adhm.201570030
Type:
Article
ISSN:
21922640
Sponsors:
The authors acknowledge the financial support under KAUST Office of Competitive Research Funds CRG-1 Award (CRG-1-2012-HUS-008) for this work. The authors thank KAUST Microfluidics Lab, Prof. Jurgen Kosel and Dr. Ulrich Buttner for the thermal imaging system. The authors appreciate the useful discussions with Dr. Hossain M. Fahad and Dr. Jhonathan P. Rojas. The authors also thank Ms. Caitlin Clark for reviewing the literature of this paper. M.M.H. conceived the idea and directed the experiment. A.M.H. carried out the experiment. E.B.L., G.A.T.S., and J.M.N. provided experimental support. A.M.H. and M.M.H. analyzed the data and wrote the paper. All authors reviewed the paper.
Appears in Collections:
Articles; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorHussain, Aftab M.en
dc.contributor.authorLizardo, Ernesto B.en
dc.contributor.authorSevilla, Galo T.en
dc.contributor.authorNassar, Joanna M.en
dc.contributor.authorHussain, Muhammad Mustafaen
dc.date.accessioned2015-08-03T12:19:17Zen
dc.date.available2015-08-03T12:19:17Zen
dc.date.issued2014-12-03en
dc.identifier.issn21922640en
dc.identifier.doi10.1002/adhm.201400647en
dc.identifier.doi10.1002/adhm.201570030en
dc.identifier.urihttp://hdl.handle.net/10754/563912en
dc.description.abstractUnprecedented 800% stretchable, non-polymeric, widely used, low-cost, naturally rigid, metallic thin-film copper (Cu)-based flexible and non-invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low-cost complementary metal oxide semiconductor (CMOS) compatible integration. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.en
dc.description.sponsorshipThe authors acknowledge the financial support under KAUST Office of Competitive Research Funds CRG-1 Award (CRG-1-2012-HUS-008) for this work. The authors thank KAUST Microfluidics Lab, Prof. Jurgen Kosel and Dr. Ulrich Buttner for the thermal imaging system. The authors appreciate the useful discussions with Dr. Hossain M. Fahad and Dr. Jhonathan P. Rojas. The authors also thank Ms. Caitlin Clark for reviewing the literature of this paper. M.M.H. conceived the idea and directed the experiment. A.M.H. carried out the experiment. E.B.L., G.A.T.S., and J.M.N. provided experimental support. A.M.H. and M.M.H. analyzed the data and wrote the paper. All authors reviewed the paper.en
dc.publisherWileyen
dc.subjectCopperen
dc.subjectFlexibilityen
dc.subjectPain managementen
dc.subjectStretchabilityen
dc.subjectThermal patchesen
dc.titleUltrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapyen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalAdvanced Healthcare Materialsen
kaust.authorHussain, Aftab M.en
kaust.authorLizardo, Ernesto B.en
kaust.authorSevilla, Galo T.en
kaust.authorNassar, Joanna M.en
kaust.authorHussain, Muhammad Mustafaen
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