PMMA to Polystyrene bonding for polymer based microfluidic systems

Handle URI:
http://hdl.handle.net/10754/562692
Title:
PMMA to Polystyrene bonding for polymer based microfluidic systems
Authors:
Fan, Yiqiang; Li, Huawei; Yi, Ying; Foulds, Ian G.
Abstract:
A thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 C with a varying compression force, from 700 to 1,000 N (0.36-0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully. © 2013 Springer-Verlag Berlin Heidelberg.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe); Electrical Engineering Program
Publisher:
Springer Verlag
Journal:
Microsystem Technologies
Issue Date:
29-Mar-2013
DOI:
10.1007/s00542-013-1778-z
Type:
Article
ISSN:
09467076
Appears in Collections:
Articles; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorFan, Yiqiangen
dc.contributor.authorLi, Huaweien
dc.contributor.authorYi, Yingen
dc.contributor.authorFoulds, Ian G.en
dc.date.accessioned2015-08-03T11:01:43Zen
dc.date.available2015-08-03T11:01:43Zen
dc.date.issued2013-03-29en
dc.identifier.issn09467076en
dc.identifier.doi10.1007/s00542-013-1778-zen
dc.identifier.urihttp://hdl.handle.net/10754/562692en
dc.description.abstractA thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 C with a varying compression force, from 700 to 1,000 N (0.36-0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully. © 2013 Springer-Verlag Berlin Heidelberg.en
dc.publisherSpringer Verlagen
dc.titlePMMA to Polystyrene bonding for polymer based microfluidic systemsen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)en
dc.contributor.departmentElectrical Engineering Programen
dc.identifier.journalMicrosystem Technologiesen
kaust.authorFan, Yiqiangen
kaust.authorLi, Huaweien
kaust.authorYi, Yingen
kaust.authorFoulds, Ian G.en
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